Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules
- Yuan Gao*
- , Kai Yin
- , Claus Leth Bak
- , Asger Bjørn Jørgensen
- , Zichen Zhang
- , Hongbo Zhao
- , Stig Munk-Nielsen
- , Christian Uhrenfeldt
- , Thore Stig Aunsborg
*Corresponding author for this work
- Power Electronics Packaging, Materials and Emerging Applications
- The Faculty of Engineering and Science
- AAU Energy
- Electronic Power Grid
- Power Electronics System Integration and Materials
- Intelligent Energy Systems and Flexible Markets
- Electric Power Systems and Microgrids
- Power Grids for the Green Transition
- Sustainable Power Electronics and Electrification
Research output: Contribution to journal › Journal article › Research › peer-review
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