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Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules
Yuan Gao*, Kai Yin, Claus Leth Bak, Asger Bjørn Jørgensen, Zichen Zhang, Hongbo Zhao, Stig Munk-Nielsen, Christian Uhrenfeldt, Thore Stig Aunsborg
*Corresponding author for this work
Research output: Contribution to journal › Journal article › Research › peer-review