Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules

Yuan Gao^*
, Kai Yin
, Claus Leth Bak
, Asger Bjørn Jørgensen
, Zichen Zhang
, Hongbo Zhao
, Stig Munk-Nielsen
, Christian Uhrenfeldt
, Thore Stig Aunsborg

^*Corresponding author for this work

Research output: Contribution to journal › Journal article › Research › peer-review

9 Citations (Scopus)

1 results

Finished
Design of Robust and Compact 15kV SiC MOSFET Power Modules
Gao, Y. (PI), Uhrenfeldt, C. (Supervisor), Munk-Nielsen, S. (Supervisor) & Wang, Q. (Supervisor)
01/04/2021 → 30/09/2024
Project: PhD Project