Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules

Yuan Gao^*, Kai Yin, Claus Leth Bak, Asger Bjørn Jørgensen, Zichen Zhang, Hongbo Zhao, Stig Munk-Nielsen, Christian Uhrenfeldt, Thore Stig Aunsborg

^*Corresponding author for this work

Research output: Contribution to journal › Journal article › Research › peer-review

1 results

Finished
Design of Robust and Compact 15kV SiC MOSFET Power Modules
Gao, Y. (PI), Uhrenfeldt, C. (Supervisor), Munk-Nielsen, S. (Supervisor) & Wang, Q. (Supervisor)
01/04/2021 → 30/09/2024
Project: PhD Project