Junction Temperature Estimation Technologies of IGBT Modules in Converter-Based Applications

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Abstract

Insulated Gate Bipolar Transistor modules, known as IGBT modules, play a critical and indispensable role in a wide range of power converter applications. However, IGBT modules are not immune to failures, which can have severe consequences such as system faults, downtime, and economic losses for industries relying on their functionality. Accurately estimating the junction temperature of IGBT modules is essential for managing their thermal characteristics, performing condition monitoring and lifetime prediction. Therefore, in this paper, recent IGBT junction temperature estimation methods of are summarized. First, the package, circuit principle and failure mode of IGBT module are introduced, followed by a discussion of various junction temperature estimation methods, including methods based on optical technologies, thermal network and Finite Element Analysis models, and temperature-sensitive electrical parameters (TSEPs). Finally, future research challenges and opportunities for implementing these technologies are presented.
Original languageEnglish
Title of host publicationIECON 2023 - 49th Annual Conference of the IEEE Industrial Electronics Society
Number of pages6
PublisherIEEE
Publication date16 Nov 2023
Pages1-6
Article number10312676
ISBN (Print)979-8-3503-3183-7
ISBN (Electronic)979-8-3503-3182-0
DOIs
Publication statusPublished - 16 Nov 2023
Event49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023 - Singapore, Singapore
Duration: 16 Oct 202319 Oct 2023

Conference

Conference49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023
Country/TerritorySingapore
CitySingapore
Period16/10/202319/10/2023

Keywords

  • IGBT
  • junction temperature
  • temperature sen-sitive electrical parameters

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