Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates

M. Brincker, P. K. Kristensen, S. Söhl, R. Eisele, V. N. Popok

Research output: Contribution to journalConference article in JournalResearchpeer-review

Original languageEnglish
JournalMicroelectronics Reliability
Volume88-90
Issue numberSeptember 2018
Pages (from-to)774-778
Number of pages5
ISSN0026-2714
DOIs
Publication statusPublished - 1 Sep 2018
Event29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Denmark
Duration: 1 Oct 20185 Oct 2018
Conference number: 29th
http://www.esref2018conf.org/

Conference

Conference29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Number29th
LocationAKKC
CountryDenmark
CityAalborg
Period01/10/201805/10/2018
Internet address

Fingerprint

liquid phases
Metals
Liquids
metals
electronic packaging
Electronics packaging
soldering
crack initiation
shear strength
Soldering
Power electronics
Crack initiation
Shear strength
Temperature
Intermetallics
Optical microscopy
homogeneity
intermetallics
voids
shear

Keywords

  • Hybrid metal baseplates
  • Reliability of interconnects
  • Transient liquid phase bonding

Cite this

@inproceedings{8fea6a38124440a8a59b83f8bbcf60ce,
title = "Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates",
keywords = "Hybrid metal baseplates, Reliability of interconnects, Transient liquid phase bonding",
author = "M. Brincker and Kristensen, {P. K.} and S. S{\"o}hl and R. Eisele and Popok, {V. N.}",
year = "2018",
month = "9",
day = "1",
doi = "10.1016/j.microrel.2018.06.051",
language = "English",
volume = "88-90",
pages = "774--778",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Pergamon Press",
number = "September 2018",

}

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects : A novel approach for hybrid metal baseplates. / Brincker, M.; Kristensen, P. K.; Söhl, S.; Eisele, R.; Popok, V. N.

In: Microelectronics Reliability, Vol. 88-90, No. September 2018, 01.09.2018, p. 774-778.

Research output: Contribution to journalConference article in JournalResearchpeer-review

TY - GEN

T1 - Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects

T2 - A novel approach for hybrid metal baseplates

AU - Brincker, M.

AU - Kristensen, P. K.

AU - Söhl, S.

AU - Eisele, R.

AU - Popok, V. N.

PY - 2018/9/1

Y1 - 2018/9/1

KW - Hybrid metal baseplates

KW - Reliability of interconnects

KW - Transient liquid phase bonding

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U2 - 10.1016/j.microrel.2018.06.051

DO - 10.1016/j.microrel.2018.06.051

M3 - Conference article in Journal

VL - 88-90

SP - 774

EP - 778

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - September 2018

ER -