Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates

M. Brincker, P. K. Kristensen, S. Söhl, R. Eisele, V. N. Popok*

*Corresponding author

Research output: Contribution to journalConference article in JournalResearchpeer-review

Original languageEnglish
JournalMicroelectronics Reliability
Volume88-90
Issue numberSeptember 2018
Pages (from-to)774-778
Number of pages5
ISSN0026-2714
DOIs
Publication statusPublished - 1 Sep 2018
Event29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Denmark
Duration: 1 Oct 20185 Oct 2018
Conference number: 29th
http://www.esref2018conf.org/

Conference

Conference29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Number29th
LocationAKKC
CountryDenmark
CityAalborg
Period01/10/201805/10/2018
Internet address

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Keywords

  • Hybrid metal baseplates
  • Reliability of interconnects
  • Transient liquid phase bonding

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