Research output per year
Research output per year
- 22 results
Search results
-
2017
An Analytical Essential Switching Loss Estimation Method for Modular Multilevel Converters with Nearest Level Modulation
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Oct 2017, Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, p. 762-767 6 p.Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
8 Citations (Scopus) -
Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Oct 2017, Proceedings of 2017 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, p. 4202-4207 6 p. (IEEE Energy Conversion Congress and Exposition).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
Open AccessFile61 Citations (Scopus)648 Downloads (Pure) -
The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Oct 2017, Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, p. 7980-7985 6 p.Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
File26 Citations (Scopus)376 Downloads (Pure) -
2018
A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Sept 2018, In: Microelectronics Reliability. 88-90, p. 519-523 5 p.Research output: Contribution to journal › Journal article › Research › peer-review
File6 Citations (Scopus)327 Downloads (Pure) -
An empirical model for thermal interface materials based on experimental characterizations under realistic conditions
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., Sept 2018, In: Microelectronics Reliability. 88-90, p. 806-811 6 p.Research output: Contribution to journal › Journal article › Research › peer-review
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Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 22 Oct 2018, 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, p. 3123-3128 6 p. 8507731Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
Open AccessFile17 Citations (Scopus)301 Downloads (Pure) -
Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., 22 Oct 2018, 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, p. 2743-2749 7 p. 8507408Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
7 Citations (Scopus) -
Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., Sept 2018, Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, p. 6830-6837 8 p. (IEEE Energy Conversion Congress and Exposition).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
2 Citations (Scopus) -
Submodule Level Power Loss Balancing Control for Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Sept 2018, Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, p. 5731 - 5736 6 p. (IEEE Energy Conversion Congress and Exposition).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
Open AccessFile13 Citations (Scopus)376 Downloads (Pure) -
2019
A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 24 May 2019, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. USA: IEEE Press, p. 313-318 6 p. 8721785. (IEEE Applied Power Electronics Conference and Exposition (APEC)).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
File155 Downloads (Pure) -
A Simplification Method for Power Device Thermal Modeling with Quantitative Error Analysis
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Sept 2019, In: IEEE Journal of Emerging and Selected Topics in Power Electronics. 7, 3, p. 1649-1658 10 p., 8713595.Research output: Contribution to journal › Journal article › Research › peer-review
18 Citations (Scopus) -
A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Dec 2019, In: IEEE Transactions on Power Electronics. 34, 12, p. 11580 - 11593 14 p., 8678463.Research output: Contribution to journal › Journal article › Research › peer-review
File21 Citations (Scopus)273 Downloads (Pure) -
Computational-Efficient Thermal Estimation for IGBT Modules under Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., 1 Sept 2019, In: IEEE Transactions on Industry Applications. 55, 5, p. 4984 - 4992 9 p., 8747388.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile14 Citations (Scopus)119 Downloads (Pure) -
Condition Monitoring for Submodule Capacitors in Modular Multilevel Converters
Wang, H., Wang, H., Wang, Z., Zhang, Y., Pei, X. & Kang, Y., Nov 2019, In: IEEE Transactions on Power Electronics. 34, 11, p. 10403 - 10407 5 p., 8718539.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile42 Citations (Scopus)206 Downloads (Pure) -
Condition monitoring method for submodule capacitor in modular multilevel converter
Wang, H., Wang, H., Zhang, Y., Wang, Z., Pei, X. & Kang, Y., Mar 2019, Proceedings of 2019 IEEE Annual Applied Power Electronics Conference and Exposition (APEC 2019). IEEE Press, p. 344-348 5 p. (IEEE Applied Power Electronics Conference and Exposition (APEC)).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
6 Citations (Scopus)6 Downloads (Pure) -
Mission Profile Based Adaptive Carrier Frequency Control for Modular Multilevel Converters for Medium Voltage Applications
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., May 2019, Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). Korea: IEEE Press, p. 1848-1853 6 p. 8796902. (International Conference on Power Electronics).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
Open AccessFile81 Downloads (Pure) -
Reliability Modeling of Power Electronic Converters: A General Approach
Peyghami, S., Wang, Z. & Blaabjerg, F., Jun 2019, Proceedings of 2019 20th Workshop on Control and Modeling for Power Electronics (COMPEL). IEEE Press, 7 p. 8769685. (IEEE Workshop on Control and Modeling for Power Electronics (COMPEL) ).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
File32 Citations (Scopus)521 Downloads (Pure) -
Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., 24 May 2019, Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, p. 319-324 6 p. 8721898. (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
Open AccessFile20 Citations (Scopus)170 Downloads (Pure) -
Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Mar 2019, In: IEEE Transactions on Industrial Electronics. 66, 3, p. 2323-2332 10 p., 8331948.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile98 Citations (Scopus)997 Downloads (Pure) -
System-Level Power Loss Evaluation of Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., Sept 2019, 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019. IEEE Press, p. 6797-6804 8 p. 8913051. (IEEE Energy Conversion Congress and Exposition).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
Open AccessFile5 Citations (Scopus)225 Downloads (Pure) -
2020
Capacitor Condition Monitoring Based on the DC-Side Start-Up of Modular Multilevel Converters
Wang, Z., Zhang, Y., Wang, H. & Blaabjerg, F., Jun 2020, In: IEEE Transactions on Power Electronics. 35, 6, p. 5589-5593 5 p., 8918114.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile38 Citations (Scopus)115 Downloads (Pure) -
Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., Jul 2020, In: IEEE Transactions on Power Electronics. 35, 7, p. 6916-6930 15 p., 8926422.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile62 Citations (Scopus)434 Downloads (Pure)