Research output per year
Research output per year
Search results
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A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Sept 2018, In: Microelectronics Reliability. 88-90, p. 519-523 5 p.Research output: Contribution to journal › Journal article › Research › peer-review
File6 Citations (Scopus)327 Downloads (Pure) -
An empirical model for thermal interface materials based on experimental characterizations under realistic conditions
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., Sept 2018, In: Microelectronics Reliability. 88-90, p. 806-811 6 p.Research output: Contribution to journal › Journal article › Research › peer-review
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A Simplification Method for Power Device Thermal Modeling with Quantitative Error Analysis
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Sept 2019, In: IEEE Journal of Emerging and Selected Topics in Power Electronics. 7, 3, p. 1649-1658 10 p., 8713595.Research output: Contribution to journal › Journal article › Research › peer-review
18 Citations (Scopus) -
A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Dec 2019, In: IEEE Transactions on Power Electronics. 34, 12, p. 11580 - 11593 14 p., 8678463.Research output: Contribution to journal › Journal article › Research › peer-review
File21 Citations (Scopus)273 Downloads (Pure) -
Capacitor Condition Monitoring Based on the DC-Side Start-Up of Modular Multilevel Converters
Wang, Z., Zhang, Y., Wang, H. & Blaabjerg, F., Jun 2020, In: IEEE Transactions on Power Electronics. 35, 6, p. 5589-5593 5 p., 8918114.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile38 Citations (Scopus)115 Downloads (Pure) -
Computational-Efficient Thermal Estimation for IGBT Modules under Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., 1 Sept 2019, In: IEEE Transactions on Industry Applications. 55, 5, p. 4984 - 4992 9 p., 8747388.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile14 Citations (Scopus)119 Downloads (Pure) -
Condition Monitoring for Submodule Capacitors in Modular Multilevel Converters
Wang, H., Wang, H., Wang, Z., Zhang, Y., Pei, X. & Kang, Y., Nov 2019, In: IEEE Transactions on Power Electronics. 34, 11, p. 10403 - 10407 5 p., 8718539.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile43 Citations (Scopus)206 Downloads (Pure) -
Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., Jul 2020, In: IEEE Transactions on Power Electronics. 35, 7, p. 6916-6930 15 p., 8926422.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile62 Citations (Scopus)435 Downloads (Pure) -
Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Mar 2019, In: IEEE Transactions on Industrial Electronics. 66, 3, p. 2323-2332 10 p., 8331948.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile98 Citations (Scopus)999 Downloads (Pure)