Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang*, Huai Wang, Zhongxu Wang, Frede Blaabjerg, Maryam Saeedifard

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

16 Citations (Scopus)
138 Downloads (Pure)


This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

Original languageEnglish
Article number8926422
JournalIEEE Transactions on Power Electronics
Issue number7
Pages (from-to)6916-6930
Number of pages15
Publication statusPublished - Jul 2020


  • Modular multilevel converters (MMCs)
  • power losses
  • redundancy
  • reliability
  • thermal analysis


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