Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang; Huai Wang; Zhongxu Wang; Frede Blaabjerg; Maryam Saeedifard

doi:10.1109/TPEL.2019.2957826

Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang^*, Huai Wang, Zhongxu Wang, Frede Blaabjerg, Maryam Saeedifard

^*Corresponding author for this work

Research output: Contribution to journal › Journal article › Research › peer-review

74 Citations (Scopus)

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Abstract

This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

Original language	English
Article number	8926422
Journal	IEEE Transactions on Power Electronics
Volume	35
Issue number	7
Pages (from-to)	6916-6930
Number of pages	15
ISSN	0885-8993
DOIs	https://doi.org/10.1109/TPEL.2019.2957826
Publication status	Published - Jul 2020

Keywords

Modular multilevel converters (MMCs)
power losses
redundancy
reliability
thermal analysis

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10.1109/TPEL.2019.2957826

08926422Accepted author manuscript, 19.7 MB

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@article{1b978e4dbccf4c5a9445a71c29141506,

title = "Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters",

abstract = "This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.",

keywords = "Modular multilevel converters (MMCs), power losses, redundancy, reliability, thermal analysis",

author = "Yi Zhang and Huai Wang and Zhongxu Wang and Frede Blaabjerg and Maryam Saeedifard",

year = "2020",

month = jul,

doi = "10.1109/TPEL.2019.2957826",

language = "English",

volume = "35",

pages = "6916--6930",

journal = "IEEE Transactions on Power Electronics",

issn = "0885-8993",

publisher = "IEEE (Institute of Electrical and Electronics Engineers)",

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TY - JOUR

T1 - Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

AU - Zhang, Yi

AU - Wang, Huai

AU - Wang, Zhongxu

AU - Blaabjerg, Frede

AU - Saeedifard, Maryam

PY - 2020/7

Y1 - 2020/7

N2 - This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

AB - This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

KW - Modular multilevel converters (MMCs)

KW - power losses

KW - redundancy

KW - reliability

KW - thermal analysis

UR - http://www.scopus.com/inward/record.url?scp=85082300198&partnerID=8YFLogxK

U2 - 10.1109/TPEL.2019.2957826

DO - 10.1109/TPEL.2019.2957826

M3 - Journal article

SN - 0885-8993

VL - 35

SP - 6916

EP - 6930

JO - IEEE Transactions on Power Electronics

JF - IEEE Transactions on Power Electronics

IS - 7

M1 - 8926422

ER -

Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

Abstract

Keywords

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The First Place Prize Paper Award for 2020 in the IEEE Transactions on Power Electronics

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this

Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

Abstract

Keywords

Access to Document

AUB Link

Other files and links

Fingerprint

Prizes

The First Place Prize Paper Award for 2020 in the IEEE Transactions on Power Electronics

Research output

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this