Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Amir Sajjad Bahman; Francesco Iannuzzo; Christian Uhrenfeldt; Frede Blaabjerg; Stig Munk-Nielsen

doi:10.1109/TIA.2017.2702594

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Amir Sajjad Bahman, Francesco Iannuzzo, Christian Uhrenfeldt, Frede Blaabjerg, Stig Munk-Nielsen

Research output: Contribution to journal › Journal article › Research › peer-review

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Abstract

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

Original language	English
Journal	I E E E Transactions on Industry Applications
Volume	53
Issue number	5
Pages (from-to)	4788 - 4795
Number of pages	8
ISSN	0093-9994
DOIs	https://doi.org/10.1109/TIA.2017.2702594
Publication status	Published - Sept 2017

Keywords

Electro-thermal models
Insulated gate bipolar transistor (IGBT)
Reliability
Short-circuit
Solder fatigue

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10.1109/TIA.2017.2702594

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT ModulesAccepted author manuscript, 996 KB

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APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F. (PI), Munk-Nielsen, S. (CoI), Iannuzzo, F. (Project Participant), Wang, H. (Project Participant), Uhrenfeldt, C. (Project Participant), Beczkowski, S. (Project Participant), Zhou, D. (Project Participant), Choi, U. (Project Participant), Jørgensen, A. B. (Project Participant), Vernica, I. (Project Participant), Sangwongwanich, A. (Project Participant), Christensen, N. (Project Participant), Ceccarelli, L. (Project Participant), Nielsen, C. K. (Project Participant), Bahman, A. S. (Project Participant), Pedersen, K. (Project Participant), Pedersen, K. B. (Project Participant) & Kristensen, P. K. (Project Participant)
Innovation Fund Denmark
01/01/2017 → 30/06/2021
Project: Research

Cite this

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title = "Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules",

abstract = "In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.",

keywords = "Electro-thermal models, Insulated gate bipolar transistor (IGBT), Reliability, Short-circuit, Solder fatigue",

author = "Bahman, {Amir Sajjad} and Francesco Iannuzzo and Christian Uhrenfeldt and Frede Blaabjerg and Stig Munk-Nielsen",

year = "2017",

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doi = "10.1109/TIA.2017.2702594",

language = "English",

volume = "53",

pages = "4788 -- 4795",

journal = "I E E E Transactions on Industry Applications",

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publisher = "IEEE (Institute of Electrical and Electronics Engineers)",

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T1 - Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

AU - Bahman, Amir Sajjad

AU - Iannuzzo, Francesco

AU - Uhrenfeldt, Christian

AU - Blaabjerg, Frede

AU - Munk-Nielsen, Stig

PY - 2017/9

Y1 - 2017/9

N2 - In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

AB - In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

KW - Electro-thermal models

KW - Insulated gate bipolar transistor (IGBT)

KW - Reliability

KW - Short-circuit

KW - Solder fatigue

U2 - 10.1109/TIA.2017.2702594

DO - 10.1109/TIA.2017.2702594

M3 - Journal article

SN - 0093-9994

VL - 53

SP - 4788

EP - 4795

JO - I E E E Transactions on Industry Applications

JF - I E E E Transactions on Industry Applications

IS - 5

ER -

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Abstract

Keywords

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APETT: Advanced Power Electronic Technology and Tools

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