Modular Multilevel Converters Based on Interleaved Half-Bridge Submodules

Aleksandr Viatkin, Mattia Ricco, Riccardo Mandrioli, Tamas Kerekes, Remus Teodorescu, Gabriele Grandi

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

7 Citations (Scopus)

Abstract

This paper reports a novel modular multilevel converter with interleaved sub-modules (ISM-MMC). The ISM-MMC exhibit a higher scalability in current rating then conventional MMC structures with parallel devices. It can employ low-cost, low-current power switches rather than their bulky and expensive counterparts normally designed in classical MMCs. Another remarkable feature is that the number of the output voltage levels is synthetically multiplied by the number of interleaved SMs. The ISM-MMC is capable of bringing the known advantages of MMC to low voltage - high power applications making it a good candidate for the sector of ultra-fast chargers for electrical vehicles where typical power rating in excess of 1 MW is required for the low voltage supply. A proper modulation scheme is implemented and explained in this paper. A comparison with a classical MMC topology is also provided in terms of number of voltage levels, output voltage harmonic content, and number of components by fixing the number of SMs. Simulation results are given to demonstrate the feasibility of the proposed topology and the implemented modulation scheme. Despite this paper is dealing with a single-phase configuration, the extension to a three-phase scheme can be obtained in a straightforward manner.

Original languageEnglish
Title of host publicationProceedings - 2021 22nd IEEE International Conference on Industrial Technology, ICIT 2021
Number of pages6
PublisherIEEE
Publication date10 Mar 2021
Pages440-445
Article number9453643
ISBN (Electronic)9781728157306
DOIs
Publication statusPublished - 10 Mar 2021
Event22nd IEEE International Conference on Industrial Technology, ICIT 2021 - Valencia, Spain
Duration: 10 Mar 202112 Mar 2021

Conference

Conference22nd IEEE International Conference on Industrial Technology, ICIT 2021
Country/TerritorySpain
CityValencia
Period10/03/202112/03/2021
SponsorIEEE Industrial Electronics Society (IES), The Institute of Electrical and Electronics Engineers (IEEE)

Bibliographical note

Publisher Copyright:
© 2021 IEEE.

Keywords

  • interleaved half-bridges
  • modular
  • modular multilevel converter (MMC)
  • modulation technique
  • sub-modules
  • ultra-fast ev chargers

Fingerprint

Dive into the research topics of 'Modular Multilevel Converters Based on Interleaved Half-Bridge Submodules'. Together they form a unique fingerprint.

Cite this