Multi-timescale modelling for the loading behaviours of power electronics converter

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

24 Citations (Scopus)


The thermal dynamics of power device, referred as “thermal cycling”, are closely related to the reliability as well as the cost of the power electronics converter. However, the device loading is disturbed by many factors of the converter system which present at various times-constants from micro-seconds to years, thereby the complete loading conditions of power device are still challenge to be predicted by the existing models, which normally have to be restricted at certain time ranges. As a result, a more advanced modelling concept is proposed in this paper, which separates the converter system into three modelling levels according to the timescales of the interested thermal dynamics and their disturbances. A series of multi-disciplinary models are then established including the whole set of control, electrical, loss and thermal parts of the converter. It is concluded that, by the proposed multi-timescales modelling concept and approaches, more complete loading information of power device can be mapped based on the mission profiles of converter, thus it is very helpful for better prediction of converter lifetime and more cost-effective design of the cooling system.
Original languageEnglish
Title of host publicationProceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE)
Number of pages8
PublisherIEEE Press
Publication dateSep 2015
Pages5749 - 5756
ISBN (Print)978-1-4673-7151-3
Publication statusPublished - Sep 2015
Event2015 IEEE Energy Conversion Congress and Exposition (ECCE) - Montreal, Canada
Duration: 20 Sep 201524 Sep 2015


Conference2015 IEEE Energy Conversion Congress and Exposition (ECCE)

Fingerprint Dive into the research topics of 'Multi-timescale modelling for the loading behaviours of power electronics converter'. Together they form a unique fingerprint.

Cite this