Non-destructive detection of current distribution in power modules based on pulsed magnetic measurement

G. Busatto; F. Iannuzzo; F. Velardi; M. Valentino; G. P. Pepe

doi:10.1016/S0026-2714(03)00324-X

Non-destructive detection of current distribution in power modules based on pulsed magnetic measurement

G. Busatto^*, F. Iannuzzo, F. Velardi, M. Valentino, G. P. Pepe

^*Corresponding author for this work

Research output: Contribution to journal › Conference article in Journal › Research › peer-review

Abstract

A new non destructive technique able to evaluate current distribution inside a power module is presented. It is based on the dynamic measurement of the map of the magnetic field close to the backside of the module underneath its base-plate. This magnetic filed is sensitive to the eddy currents and the proper value of the magnetic field can be extracted by identifying a suited time interval on the dynamic response of the sensor. The paper shows that the magnetic field is sensitive to the current flowing through the connections between the chips and is sensitive to current variation lower than 5% of the nominal current.

Original language	English
Journal	Microelectronics Reliability
Volume	43
Issue number	9-11
Pages (from-to)	1907-1912
Number of pages	6
ISSN	0026-2714
DOIs	https://doi.org/10.1016/S0026-2714(03)00324-X
Publication status	Published - 1 Sept 2003
Externally published	Yes
Event	14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, France Duration: 7 Oct 2003 → 10 Oct 2003

Conference

Conference	14th European Symposium on Reliability of Electron Devices, Fa
Country/Territory	France
City	Bordeaux, France
Period	07/10/2003 → 10/10/2003

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title = "Non-destructive detection of current distribution in power modules based on pulsed magnetic measurement",

abstract = "A new non destructive technique able to evaluate current distribution inside a power module is presented. It is based on the dynamic measurement of the map of the magnetic field close to the backside of the module underneath its base-plate. This magnetic filed is sensitive to the eddy currents and the proper value of the magnetic field can be extracted by identifying a suited time interval on the dynamic response of the sensor. The paper shows that the magnetic field is sensitive to the current flowing through the connections between the chips and is sensitive to current variation lower than 5% of the nominal current.",

author = "G. Busatto and F. Iannuzzo and F. Velardi and M. Valentino and Pepe, {G. P.}",

year = "2003",

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doi = "10.1016/S0026-2714(03)00324-X",

language = "English",

volume = "43",

pages = "1907--1912",

journal = "Microelectronics Reliability",

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AU - Busatto, G.

AU - Iannuzzo, F.

AU - Velardi, F.

AU - Valentino, M.

AU - Pepe, G. P.

PY - 2003/9/1

Y1 - 2003/9/1

N2 - A new non destructive technique able to evaluate current distribution inside a power module is presented. It is based on the dynamic measurement of the map of the magnetic field close to the backside of the module underneath its base-plate. This magnetic filed is sensitive to the eddy currents and the proper value of the magnetic field can be extracted by identifying a suited time interval on the dynamic response of the sensor. The paper shows that the magnetic field is sensitive to the current flowing through the connections between the chips and is sensitive to current variation lower than 5% of the nominal current.

AB - A new non destructive technique able to evaluate current distribution inside a power module is presented. It is based on the dynamic measurement of the map of the magnetic field close to the backside of the module underneath its base-plate. This magnetic filed is sensitive to the eddy currents and the proper value of the magnetic field can be extracted by identifying a suited time interval on the dynamic response of the sensor. The paper shows that the magnetic field is sensitive to the current flowing through the connections between the chips and is sensitive to current variation lower than 5% of the nominal current.

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U2 - 10.1016/S0026-2714(03)00324-X

DO - 10.1016/S0026-2714(03)00324-X

M3 - Conference article in Journal

AN - SCOPUS:0042193153

SN - 0026-2714

VL - 43

SP - 1907

EP - 1912

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-11

T2 - 14th European Symposium on Reliability of Electron Devices, Fa

Y2 - 7 October 2003 through 10 October 2003

ER -

Non-destructive detection of current distribution in power modules based on pulsed magnetic measurement

Abstract

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