Abstract
The SPICE model allows the concurrent simulation of thermoelectric devices and application electric sub-models. It is an important step to implement the thermoelectric modeling at the system level. In this paper, temperature dependent material properties in the SPICE model, temperature and heat flow obtained by the code ANSYS Multiphysics and SPICE (Simulation Program with Integrated Circuit Emphasis), as well as some notes on the 3-D extension of the SPICE model are introduced.
Original language | English |
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Title of host publication | Proceedings of meeting on Applied Scientific Computing and Tools |
Number of pages | 9 |
Publication date | 2007 |
Pages | 213-221 |
Publication status | Published - 2007 |
Event | Meeting on Applied Scientific Computing and Tools - Rome, Italy Duration: 13 Sept 2007 → 14 Sept 2007 Conference number: 7 |
Conference
Conference | Meeting on Applied Scientific Computing and Tools |
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Number | 7 |
Country/Territory | Italy |
City | Rome |
Period | 13/09/2007 → 14/09/2007 |
Keywords
- Thermoelectric Energy Systems
- Temperature polynomial functions