Notes on Computational Methodology and Tools of Thermoelectric Energy Systems

Min Chen, Inger Palsgaard Bach, Lasse Rosendahl, Thomas Condra, John Kim Pedersen

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

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Abstract

The SPICE model allows the concurrent simulation of thermoelectric devices and application electric sub-models. It is an important step to implement the thermoelectric modeling at the system level. In this paper, temperature dependent material properties in the SPICE model, temperature and heat flow obtained by the code ANSYS Multiphysics and SPICE (Simulation Program with Integrated Circuit Emphasis), as well as some notes on the 3-D extension of the SPICE model are introduced.
Original languageEnglish
Title of host publicationProceedings of meeting on Applied Scientific Computing and Tools
Number of pages9
Publication date2007
Pages213-221
Publication statusPublished - 2007
EventMeeting on Applied Scientific Computing and Tools - Rome, Italy
Duration: 13 Sep 200714 Sep 2007
Conference number: 7

Conference

ConferenceMeeting on Applied Scientific Computing and Tools
Number7
CountryItaly
CityRome
Period13/09/200714/09/2007

Keywords

  • Thermoelectric Energy Systems
  • Temperature polynomial functions

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