TY - GEN
T1 - Numerical simulation of boiling in a cavity
AU - Yahyaee, Ali
AU - Haervig, Jakob
AU - Bahman, Amir Sajjad
AU - Sorensen, Henrik
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/9/14
Y1 - 2020/9/14
N2 - The formation of bubbles and their departure from a superheated horizontal surface is simulated in this paper. The bubble nucleation occurs from a cylindrical cavity. The simulation will be done by a new OpenFOAM-based two phase solver. The two-dimensional Taylor wave problem, which is a well-known benchmark for boiling phenomena, is used to validate the model and simulation. The boiling starts from a cavity and the growth and departure of the created bubbles are simulated. The bubble dynamic, temperature, and pressure distributions have been analyzed, demonstrating the capability of the new developed OpenFOAM-based two phase solver to predict boiling phenomena.
AB - The formation of bubbles and their departure from a superheated horizontal surface is simulated in this paper. The bubble nucleation occurs from a cylindrical cavity. The simulation will be done by a new OpenFOAM-based two phase solver. The two-dimensional Taylor wave problem, which is a well-known benchmark for boiling phenomena, is used to validate the model and simulation. The boiling starts from a cavity and the growth and departure of the created bubbles are simulated. The bubble dynamic, temperature, and pressure distributions have been analyzed, demonstrating the capability of the new developed OpenFOAM-based two phase solver to predict boiling phenomena.
UR - http://www.scopus.com/inward/record.url?scp=85106448100&partnerID=8YFLogxK
U2 - 10.1109/THERMINIC49743.2020.9420524
DO - 10.1109/THERMINIC49743.2020.9420524
M3 - Article in proceeding
AN - SCOPUS:85106448100
SN - 978-1-7281-7644-4
T3 - International Workshop on Thermal Investigations of ICs and Systems
SP - 1
EP - 5
BT - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
PB - IEEE
T2 - 26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020
Y2 - 14 September 2020 through 9 October 2020
ER -