Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

Research output: Book/ReportPh.D. thesisResearch

91 Downloads (Pure)
Original languageEnglish
PublisherAalborg Universitetsforlag
Number of pages176
ISBN (Electronic)978-87-7210-426-3
Publication statusPublished - 2019
SeriesPh.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet
ISSN2446-1636

Bibliographical note

PhD supervisor:
Prof. Stig Munk-Nielsen, Aalborg University

Assistant PhD supervisor:
Assoc. Prof. Christian Uhrenfeldt, Aalborg University
Assoc. Prof. Szymon Beczkowski, Aalborg University

Keywords

  • Packaging
  • Wide bandgap devices
  • Circuit simulation
  • Power modules
  • Finite element method
  • Silicon carbide
  • Gallium nitride

Cite this

Jørgensen, A. B. (2019). Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design. Aalborg Universitetsforlag. Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet
Jørgensen, Asger Bjørn. / Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design. Aalborg Universitetsforlag, 2019. 176 p. (Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet).
@phdthesis{dfc1830565234046953654c4e093ba15,
title = "Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design",
keywords = "Packaging, Wide bandgap devices, Circuit simulation, Power modules, Finite element method, Silicon carbide, Gallium nitride",
author = "J{\o}rgensen, {Asger Bj{\o}rn}",
note = "PhD supervisor: Prof. Stig Munk-Nielsen, Aalborg University Assistant PhD supervisor: Assoc. Prof. Christian Uhrenfeldt, Aalborg University Assoc. Prof. Szymon Beczkowski, Aalborg University",
year = "2019",
language = "English",
series = "Ph.d.-serien for Det Ingeni{\o}r- og Naturvidenskabelige Fakultet, Aalborg Universitet",
publisher = "Aalborg Universitetsforlag",

}

Jørgensen, AB 2019, Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design. Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet, Aalborg Universitetsforlag.

Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design. / Jørgensen, Asger Bjørn.

Aalborg Universitetsforlag, 2019. 176 p. (Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet).

Research output: Book/ReportPh.D. thesisResearch

TY - BOOK

T1 - Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

AU - Jørgensen, Asger Bjørn

N1 - PhD supervisor: Prof. Stig Munk-Nielsen, Aalborg University Assistant PhD supervisor: Assoc. Prof. Christian Uhrenfeldt, Aalborg University Assoc. Prof. Szymon Beczkowski, Aalborg University

PY - 2019

Y1 - 2019

KW - Packaging

KW - Wide bandgap devices

KW - Circuit simulation

KW - Power modules

KW - Finite element method

KW - Silicon carbide

KW - Gallium nitride

M3 - Ph.D. thesis

T3 - Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet

BT - Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

PB - Aalborg Universitetsforlag

ER -

Jørgensen AB. Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design. Aalborg Universitetsforlag, 2019. 176 p. (Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet).