Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

Research output: Book/ReportPh.D. thesisResearch

277 Downloads (Pure)
Original languageEnglish
PublisherAalborg Universitetsforlag
Number of pages176
ISBN (Electronic)978-87-7210-426-3
Publication statusPublished - 2019
SeriesPh.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet
ISSN2446-1636

Bibliographical note

PhD supervisor:
Prof. Stig Munk-Nielsen, Aalborg University

Assistant PhD supervisor:
Assoc. Prof. Christian Uhrenfeldt, Aalborg University
Assoc. Prof. Szymon Beczkowski, Aalborg University

Keywords

  • Packaging
  • Wide bandgap devices
  • Circuit simulation
  • Power modules
  • Finite element method
  • Silicon carbide
  • Gallium nitride

Cite this

Jørgensen, A. B. (2019). Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design. Aalborg Universitetsforlag. Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet