Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

Research output: PhD thesis

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Original languageEnglish
Supervisors
  • Munk-Nielsen, Stig, Principal supervisor
  • Uhrenfeldt, Christian, Co-supervisor
  • Beczkowski, Szymon, Co-supervisor
Publisher
Electronic ISBNs978-87-7210-426-3
DOIs
Publication statusPublished - 2019

Bibliographical note

PhD supervisor:
Prof. Stig Munk-Nielsen, Aalborg University

Assistant PhD supervisor:
Assoc. Prof. Christian Uhrenfeldt, Aalborg University
Assoc. Prof. Szymon Beczkowski, Aalborg University

Keywords

  • Packaging
  • Wide bandgap devices
  • Circuit simulation
  • Power modules
  • Finite element method
  • Silicon carbide
  • Gallium nitride

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