Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

Research output: Book/ReportPh.D. thesis

910 Downloads (Pure)
Original languageEnglish
PublisherAalborg Universitetsforlag
Number of pages176
ISBN (Electronic)978-87-7210-426-3
Publication statusPublished - 2019
SeriesPh.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet

Bibliographical note

PhD supervisor:
Prof. Stig Munk-Nielsen, Aalborg University

Assistant PhD supervisor:
Assoc. Prof. Christian Uhrenfeldt, Aalborg University
Assoc. Prof. Szymon Beczkowski, Aalborg University


  • Packaging
  • Wide bandgap devices
  • Circuit simulation
  • Power modules
  • Finite element method
  • Silicon carbide
  • Gallium nitride

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