Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

2 Citations (Scopus)
566 Downloads (Pure)


In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.
Original languageEnglish
Title of host publicationProceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016
Number of pages7
PublisherIEEE Press
Publication dateSep 2016
ISBN (Electronic)978-1-5090-0737-0
Publication statusPublished - Sep 2016
Event 8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, United States
Duration: 18 Sep 201622 Sep 2016


Conference 8th Annual IEEE Energy Conversion Congress & Exposition
Country/TerritoryUnited States
CityMilwaukee, WI
SponsorIEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS)
Internet address


  • Electro-thermal models
  • Insulated gate bipolar transistor (IGBT)
  • Reliability
  • Short-circuit
  • Solder fatigue


Dive into the research topics of 'Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules'. Together they form a unique fingerprint.

Cite this