Proof-of-concept for a kelvin-emitter on-chip temperature sensor for power semiconductors

Nick Baker*, Francesco Iannuzzo, Szymon Beczkowski, Peter Kjear Kristensen

*Corresponding author for this work

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

8 Citations (Scopus)

Abstract

This paper presents the use of a kelvin-emitter resistor as a junction temperature sensor in IGBTs. The kelvin-emitter resistor is placed directly on the IGBT die surface. The resistance is then evaluated using a sensing current injected between the power-emitter and kelvin-emitter terminals. The kelvin-emitter resistor is part of the overall gate resistance of the IGBT. Due to the resistor design, the temperature measured is a local temperature that correlates with the top of the resistor.
Original languageEnglish
Title of host publicationProceedings of 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
Number of pages8
PublisherIEEE Signal Processing Society
Publication dateSept 2019
Article number8914963
ISBN (Electronic)978-9-0758-1531-3
DOIs
Publication statusPublished - Sept 2019
Event21st European Conference on Power Electronics and Applications, EPE 2019 ECCE Europe - Genova, Italy
Duration: 3 Sept 20195 Sept 2019

Conference

Conference21st European Conference on Power Electronics and Applications, EPE 2019 ECCE Europe
Country/TerritoryItaly
CityGenova
Period03/09/201905/09/2019

Keywords

  • IGBT
  • MOSFET
  • Reliability
  • Semiconductor Devicc
  • Thermal design

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