Projects per year
Abstract
In this PhD thesis, the thermo-mechanical reliability performance of 10 kV SiC-MOSFET power modules, which is a promising power electronics for medium voltage applications, is evaluated for power cycling and thermal cycling tests using 3D thermo-mechanical simulation.
Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.
Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.
| Original language | English |
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| Electronic ISBNs | 978-87-85239-30-3 |
| DOIs | |
| Publication status | Published - 2024 |
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CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. (Project Participant), Ahmad, F. (Project Participant), Meinert, J. D. (Project Participant), Kubulus, P. P. (Project Participant), Takahashi, M. (Project Participant), Sun, Z. (Project Participant), Wang, R. (Project Participant), Gao, Y. (Project Participant), Zäch, M. R. (Project Participant), Meyer, S. (Project Participant), Liccardi, S. (Project Participant), Kristensen, N. H. (Project Participant) & Steffensen, B. (Project Coordinator)
01/01/2021 → 31/12/2026
Project: Research
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Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module
Takahashi, M. (PI), Uhrenfeldt, C. (Supervisor), Munk-Nielsen, S. (Supervisor) & Jørgensen, A. B. (Supervisor)
01/10/2021 → 30/09/2024
Project: PhD Project
Activities
- 1 Visiting another research institution
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Kyushu Institute of Technology
Takahashi, M. (Visiting researcher)
1 Oct 2023 → 31 Dec 2023Activity: Visiting another research institution
Prizes
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APEC 2023 Outstanding poster award
Takahashi, M. (Recipient), Jørgensen, J. K. (Recipient), Jørgensen, A. B. (Recipient), Munk-Nielsen, S. (Recipient) & Uhrenfeldt, C. (Recipient), 23 Mar 2023
Prize: Conference prizes