Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

2 Citations (Scopus)

Abstract

Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.
Original languageEnglish
Title of host publicationProceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)
Number of pages8
Place of PublicationUSA
PublisherIEEE Press
Publication dateSep 2018
Pages6830-6837
ISBN (Print)978-1-4799-7313-2
ISBN (Electronic)978-1-4799-7312-5
DOIs
Publication statusPublished - Sep 2018
EventIEEE Energy Conversion Congress & Exposition ECCE 2018 - Portland, United States
Duration: 23 Sep 201827 Sep 2018
http://www.ieee-ecce.org/2018/

Conference

ConferenceIEEE Energy Conversion Congress & Exposition ECCE 2018
Country/TerritoryUnited States
CityPortland
Period23/09/201827/09/2018
Internet address
SeriesIEEE Energy Conversion Congress and Exposition
ISSN2329-3721

Fingerprint

Dive into the research topics of 'Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters'. Together they form a unique fingerprint.

Cite this