Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Yi Zhang; Huai Wang; Zhongxu Wang; Frede Blaabjerg

doi:10.1109/ECCE.2018.8558180

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Yi Zhang, Huai Wang, Zhongxu Wang, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

2 Citations (Scopus)

Abstract

Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

Original language	English
Title of host publication	Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)
Number of pages	8
Place of Publication	USA
Publisher	IEEE Press
Publication date	Sept 2018
Pages	6830-6837
ISBN (Print)	978-1-4799-7313-2
ISBN (Electronic)	978-1-4799-7312-5
DOIs	https://doi.org/10.1109/ECCE.2018.8558180
Publication status	Published - Sept 2018
Event	IEEE Energy Conversion Congress & Exposition ECCE 2018 - Portland, United States Duration: 23 Sept 2018 → 27 Sept 2018 http://www.ieee-ecce.org/2018/

Conference

Conference	IEEE Energy Conversion Congress & Exposition ECCE 2018
Country/Territory	United States
City	Portland
Period	23/09/2018 → 27/09/2018
Internet address	http://www.ieee-ecce.org/2018/

Series	IEEE Energy Conversion Congress and Exposition
ISSN	2329-3721

Access to Document

10.1109/ECCE.2018.8558180

AUB Link

Search for the material in Aalborg University Library's search engine

1 Finished

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F. (PI), Munk-Nielsen, S. (Project Participant), Pedersen, K. (Project Participant) & Popok, V. (Project Participant)
01/04/2011 → 31/12/2016
Project: Research

1 Conference organisation or participation

IEEE Energy Conversion Congress & Exposition ECCE 2018
Wang, Z. (Participant)
23 Sept 2018 → 27 Sept 2018
Activity: Attending an event › Conference organisation or participation

2 Citations
1 PhD thesis

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters
Wang, Z., 2019, Aalborg Universitetsforlag. 111 p.
Research output: PhD thesis

Open Access
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Cite this

@inproceedings{32011c0d0e80427e9da3778db31b9e51,

title = "Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters",

abstract = "Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.",

author = "Yi Zhang and Huai Wang and Zhongxu Wang and Frede Blaabjerg",

year = "2018",

month = sep,

doi = "10.1109/ECCE.2018.8558180",

language = "English",

isbn = "978-1-4799-7313-2",

series = "IEEE Energy Conversion Congress and Exposition",

pages = "6830--6837",

booktitle = "Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)",

publisher = "IEEE Press",

note = "IEEE Energy Conversion Congress & Exposition ECCE 2018 ; Conference date: 23-09-2018 Through 27-09-2018",

url = "http://www.ieee-ecce.org/2018/",

}

Zhang, Y , Wang, H, Wang, Z & Blaabjerg, F 2018, Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. in Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). IEEE Press, USA, IEEE Energy Conversion Congress and Exposition, pp. 6830-6837, IEEE Energy Conversion Congress & Exposition ECCE 2018, Portland, Oregon, United States, 23/09/2018. https://doi.org/10.1109/ECCE.2018.8558180

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. / Zhang, Yi ; Wang, Huai; Wang, Zhongxu et al.
Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, 2018. p. 6830-6837 (IEEE Energy Conversion Congress and Exposition).

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

AU - Zhang, Yi

AU - Wang, Huai

AU - Wang, Zhongxu

AU - Blaabjerg, Frede

PY - 2018/9

Y1 - 2018/9

N2 - Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

AB - Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

U2 - 10.1109/ECCE.2018.8558180

DO - 10.1109/ECCE.2018.8558180

M3 - Article in proceeding

SN - 978-1-4799-7313-2

T3 - IEEE Energy Conversion Congress and Exposition

SP - 6830

EP - 6837

BT - Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)

PB - IEEE Press

CY - USA

T2 - IEEE Energy Conversion Congress & Exposition ECCE 2018

Y2 - 23 September 2018 through 27 September 2018

ER -

Zhang Y , Wang H, Wang Z, Blaabjerg F. Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. In Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press. 2018. p. 6830-6837. (IEEE Energy Conversion Congress and Exposition). doi: 10.1109/ECCE.2018.8558180

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Abstract

Conference

Access to Document

AUB Link

Fingerprint

Projects

Center Of Reliable Power Electronics (CORPE)

Activities

IEEE Energy Conversion Congress & Exposition ECCE 2018

Research output

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this