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In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano- or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.
|Title of host publication||Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)|
|Number of pages||6|
|Publication date||24 May 2019|
|Publication status||Published - 24 May 2019|
|Event||34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States|
Duration: 17 Mar 2019 → 21 Mar 2019
|Conference||34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019|
|Period||17/03/2019 → 21/03/2019|
|Sponsor||IEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)|
|Series||I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings|
- Power semiconductor
- Thermal coupling
- Thermal modeling
FingerprintDive into the research topics of 'Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules'. Together they form a unique fingerprint.
- 6 Citations
- 1 Ph.D. thesis
Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel ConvertersWang, Z., 2019, Aalborg Universitetsforlag. 111 p. (Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet).
Research output: Book/Report › Ph.D. thesis › ResearchOpen AccessFile