Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

Yi Zhang; Huai Wang; Zhongxu Wang; Frede Blaabjerg

doi:10.1109/APEC.2019.8721898

Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

Yi Zhang, Huai Wang, Zhongxu Wang, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

25 Citations (Scopus)

204 Downloads (Pure)

Abstract

In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano- or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.

Original language	English
Title of host publication	Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)
Number of pages	6
Publisher	IEEE Press
Publication date	24 May 2019
Pages	319-324
Article number	8721898
ISBN (Electronic)	9781538683309
DOIs	https://doi.org/10.1109/APEC.2019.8721898
Publication status	Published - 24 May 2019
Event	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States Duration: 17 Mar 2019 → 21 Mar 2019

Conference

Conference	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Country/Territory	United States
City	Anaheim
Period	17/03/2019 → 21/03/2019
Sponsor	IEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)

Series	I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings
ISSN	1048-2334

Keywords

Power semiconductor
Reliability
Thermal coupling
Thermal modeling

Access to Document

10.1109/APEC.2019.8721898

apec2019_yizAccepted author manuscript, 2.87 MB

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Cite this

@inproceedings{cea32102de8a406daeea022e0e9514d0,

title = "Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules",

abstract = "In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano- or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.",

keywords = "Power semiconductor, Reliability, Thermal coupling, Thermal modeling",

author = "Yi Zhang and Huai Wang and Zhongxu Wang and Frede Blaabjerg",

year = "2019",

month = may,

day = "24",

doi = "10.1109/APEC.2019.8721898",

language = "English",

series = "I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings",

publisher = "IEEE Press",

pages = "319--324",

booktitle = "Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)",

note = "34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 ; Conference date: 17-03-2019 Through 21-03-2019",

}

Zhang, Y , Wang, H, Wang, Z & Blaabjerg, F 2019, Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules. in Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)., 8721898, IEEE Press, I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings, pp. 319-324, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019, Anaheim, United States, 17/03/2019. https://doi.org/10.1109/APEC.2019.8721898

Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules. / Zhang, Yi ; Wang, Huai; Wang, Zhongxu et al.
Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, 2019. p. 319-324 8721898 (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

AU - Zhang, Yi

AU - Wang, Huai

AU - Wang, Zhongxu

AU - Blaabjerg, Frede

PY - 2019/5/24

Y1 - 2019/5/24

N2 - In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano- or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.

AB - In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano- or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.

KW - Power semiconductor

KW - Reliability

KW - Thermal coupling

KW - Thermal modeling

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U2 - 10.1109/APEC.2019.8721898

DO - 10.1109/APEC.2019.8721898

M3 - Article in proceeding

T3 - I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings

SP - 319

EP - 324

BT - Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

PB - IEEE Press

T2 - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

Y2 - 17 March 2019 through 21 March 2019

ER -

Zhang Y , Wang H, Wang Z, Blaabjerg F. Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules. In Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press. 2019. p. 319-324. 8721898. (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings). doi: 10.1109/APEC.2019.8721898

Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

Abstract

Conference

Keywords

Access to Document

AUB Link

Other files and links

Fingerprint

Center Of Reliable Power Electronics (CORPE)

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this

Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

Abstract

Conference

Keywords

Access to Document

AUB Link

Other files and links

Fingerprint

Projects

Center Of Reliable Power Electronics (CORPE)

Research output

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this