Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects

Mads Brincker, Stefan Söhl, Ronald Eisele, Vladimir Popok

Research output: Contribution to journalConference article in JournalResearchpeer-review

6 Citations (Scopus)

Abstract

As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems as a potential technology that could enable the realization of stacks with better thermal performance and reliability than those can be achieved using conventional soldering techniques. Low temperature TLP bonded CuSnCu samples are fabricated, and the strength of the achieved bonds is measured by shear testing. Micro-sectioning and optical microscopy studies of the samples reveal that the TLP bonds show good homogeneity with a small number of voids at the interface. Energy dispersive X-ray analysis is applied to examine at what rates Sn is converted into CuSn intermetallics since a full conversion is critical for achieving a strong and high temperature resistant bond. Finally, initial results from a thermal cycling test are presented and it is concluded that the achieved TLP bonding is a promising candidate for the fabrication of reliable interconnects in power electronics.
Original languageEnglish
JournalMicroelectronics Reliability
Volume76-77
Pages (from-to)378-382
Number of pages5
ISSN0026-2714
DOIs
Publication statusPublished - 1 Aug 2017
Event28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Bordeaux, France
Duration: 25 Sep 201728 Sep 2017

Conference

Conference28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
CountryFrance
CityBordeaux
Period25/09/201728/09/2017

Fingerprint

liquid phases
Liquids
Power electronics
thermal cycling tests
Temperature
soldering
Energy dispersive X ray analysis
Soldering
Thermal cycling
electronics
packaging
Intermetallics
Optical microscopy
homogeneity
intermetallics
voids
Packaging
tendencies
Current density
current density

Keywords

  • Transient liquid phase bonding
  • Power electronics reliabilty
  • High temperature packaging

Cite this

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title = "Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects",
abstract = "As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems as a potential technology that could enable the realization of stacks with better thermal performance and reliability than those can be achieved using conventional soldering techniques. Low temperature TLP bonded CuSnCu samples are fabricated, and the strength of the achieved bonds is measured by shear testing. Micro-sectioning and optical microscopy studies of the samples reveal that the TLP bonds show good homogeneity with a small number of voids at the interface. Energy dispersive X-ray analysis is applied to examine at what rates Sn is converted into CuSn intermetallics since a full conversion is critical for achieving a strong and high temperature resistant bond. Finally, initial results from a thermal cycling test are presented and it is concluded that the achieved TLP bonding is a promising candidate for the fabrication of reliable interconnects in power electronics.",
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author = "Mads Brincker and Stefan S{\"o}hl and Ronald Eisele and Vladimir Popok",
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doi = "10.1016/j.microrel.2017.06.041",
language = "English",
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journal = "Microelectronics Reliability",
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Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. / Brincker, Mads; Söhl, Stefan; Eisele, Ronald; Popok, Vladimir.

In: Microelectronics Reliability, Vol. 76-77, 01.08.2017, p. 378-382.

Research output: Contribution to journalConference article in JournalResearchpeer-review

TY - GEN

T1 - Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects

AU - Brincker, Mads

AU - Söhl, Stefan

AU - Eisele, Ronald

AU - Popok, Vladimir

PY - 2017/8/1

Y1 - 2017/8/1

N2 - As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems as a potential technology that could enable the realization of stacks with better thermal performance and reliability than those can be achieved using conventional soldering techniques. Low temperature TLP bonded CuSnCu samples are fabricated, and the strength of the achieved bonds is measured by shear testing. Micro-sectioning and optical microscopy studies of the samples reveal that the TLP bonds show good homogeneity with a small number of voids at the interface. Energy dispersive X-ray analysis is applied to examine at what rates Sn is converted into CuSn intermetallics since a full conversion is critical for achieving a strong and high temperature resistant bond. Finally, initial results from a thermal cycling test are presented and it is concluded that the achieved TLP bonding is a promising candidate for the fabrication of reliable interconnects in power electronics.

AB - As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems as a potential technology that could enable the realization of stacks with better thermal performance and reliability than those can be achieved using conventional soldering techniques. Low temperature TLP bonded CuSnCu samples are fabricated, and the strength of the achieved bonds is measured by shear testing. Micro-sectioning and optical microscopy studies of the samples reveal that the TLP bonds show good homogeneity with a small number of voids at the interface. Energy dispersive X-ray analysis is applied to examine at what rates Sn is converted into CuSn intermetallics since a full conversion is critical for achieving a strong and high temperature resistant bond. Finally, initial results from a thermal cycling test are presented and it is concluded that the achieved TLP bonding is a promising candidate for the fabrication of reliable interconnects in power electronics.

KW - Transient liquid phase bonding

KW - Power electronics reliabilty

KW - High temperature packaging

U2 - 10.1016/j.microrel.2017.06.041

DO - 10.1016/j.microrel.2017.06.041

M3 - Conference article in Journal

VL - 76-77

SP - 378

EP - 382

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

ER -