Abstract
The invention relates to a method of controlling thermal stress of a semiconductor chip, the method comprises the steps of: establishing a modular frequency of the semiconductor chip and thereby a thermal profile of the semiconductor chip and establishing a pulsing current controlling the thermal profile of a thermoelectric cooling device thermally connected to the semiconductor chip. Wherein the pulsing current is generated in response to the modular frequency, so that a super cooling period of the thermal profile of the thermoelectric cooling device is at least partly overlapping a temperature increasing period of the thermal profile of the semiconductor chip,anda recovery period of the thermal profile of the thermoelectric cooling device is at least partly overlapping a temperature decreasing period of the thermal profile of the semiconductor chip.
Original language | English |
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IPC | H01L 23/38 (2006.01) ,H01L 35/30 (2006.01) ,H01L 35/32 (2006.01) |
Patent number | WO2019210923 |
Filing date | 30/04/2019 |
Country/Territory | Denmark |
Publication status | Published - Nov 2019 |