The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter

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Abstract

The reliability aspect study of Modular Multilevel Converter (MMC) is of great interest in industry applications, such as offshore wind. Lifetime prediction of key components is an important tool to design MMC with fulfilled reliability specifications. While many efforts have been made to the lifetime prediction of IGBT modules in renewable energy applications by considering long-term
varying operation conditions (i.e., mission profile), the justifications of using the associated mission profiles are still missed. This paper investigates the impact of mission profile data resolutions and electrical power modeling methods on the estimated lifetime of IGBT modules in an MMC for offshore wind power application. In a 30 MW MMC case study, an annual wind speed profile with a resolution of 1 s/data, 10 minute/data, and 1 hour/data are considered, respectively. A method to re-generate higher resolution wind speed data from lower resolution data is introduced as well. Based on the wind speed data, IEC 61400-12-1 power curve model and a wind speed-power stochastic model are compared as well. Five mission profile modeling scenarios are compared in terms of the predicted lifetime of the IGBT modules used in the MMC, resulting in significant differences. The study serves as a first step to quantify the impact of mission profile modeling on lifetime prediction, and to provide a guideline on mission profile collection for the presented application.
Original languageEnglish
Title of host publicationProceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
Number of pages6
PublisherIEEE Press
Publication dateOct 2017
Pages7980-7985
ISBN (Electronic)978-1-5386-1127-2
DOIs
Publication statusPublished - Oct 2017
Event43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 - Beijing, China
Duration: 29 Oct 20171 Nov 2017

Conference

Conference43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
CountryChina
CityBeijing
Period29/10/201701/11/2017
SponsorChinese Association of Automation (CAA), Chinese Power Supply Society, et al., IEEE Industrial Electronics Society (IES), Systems Engineering Society of China, The Institute of Electrical and Electronics Engineers (IEEE)

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Zhang, Y., Wang, H., Wang, Z., Yang, Y., & Blaabjerg, F. (2017). The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter. In Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 (pp. 7980-7985). IEEE Press. https://doi.org/10.1109/IECON.2017.8217399