Thermal Activated Envelope: A Method and Model for Embedding Behaviour in a Responsive Envelope by Bi-Materials

Isak Worre Foged, Anke Pasold

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

9 Citations (Scopus)

Abstract

The research studies the making of a responsive architectural envelope based on bi-materials. The bi-materials are organized according to a method that combines different isotropic metals and plastic into an active composite structure that reacts to temperature variations. Through an evolutionary search procedure, the combination of materials and their bonding temperature is found in relation to the envelope effect on a thermal environment inside a defined space. This allows the designer to articulate dynamic composites with time-based thermal functionality, related to the material dynamics, environmental dynamics and occupancy dynamics. Lastly, a physical prototype is created, which illustrates the physical expression of the bi-materials and the problems related to manufacturing of these composite structures.
Original languageEnglish
Title of host publicationReal Time : Proceedings of the 33rd eCAADe Conference
EditorsB. Martens, G. Wurzer, T. Grasl, W. E. Lorenz, R. Schaffranek
Number of pages10
Volume2
PublisherVienna University of Technology
Publication date2015
Pages449-458
Publication statusPublished - 2015
EventeCAADe Conference - Wien, Austria
Duration: 16 Sept 201518 Sept 2015

Conference

ConferenceeCAADe Conference
Country/TerritoryAustria
CityWien
Period16/09/201518/09/2015

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