Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to become a new industrial power semiconductors packaging application method to solve the failure of wire bonding liftoff and improve the reliability of power semiconductor applications. As a crucial characteristic in use, the thermal characteristics of liquid metal interconnects for power semiconductors are obtained experimentally in this paper. By powering a diode die in a bridge busbar liquid metal interconnect structure, the thermal resistance from the die to the ambient is extracted. The result shows that the liquid metal interconnects method has the potential to improve the thermal behavior of power semiconductors compared with wire-bonding interconnection. The finite element simulation explains the possible reasons causing abnormal temperature responses among some samples. Besides, during the test, a slow decline in the forward voltage of the module is observed.

Original languageEnglish
Title of host publicationAPEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
Number of pages6
Publication date2023
Article number10131435
ISBN (Electronic)9781665475396
Publication statusPublished - 2023
Event38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 - Orlando, United States
Duration: 19 Mar 202323 Mar 2023


Conference38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023
Country/TerritoryUnited States
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)
SeriesConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Bibliographical note

Publisher Copyright:
© 2023 IEEE.


  • liquid metal
  • packaging
  • simulation
  • thermal characteristics
  • wire-bonding


Dive into the research topics of 'Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors'. Together they form a unique fingerprint.

Cite this