Abstract
In low power applications, a surface mounted device (SMD) is naturally cooled by attaching to a printed circuit board (PCB) copper pad. This paper proposes an analytical thermal resistance model and a sizing algorithm for PCB copper pads. Firstly, an axisymmetric thermal resistance model is developed for PCB copper pads where the heat conduction, convection and radiation all exist. Due to the interdependence of the conductive/radiative heat transfer coefficient and the board temperature, a new algorithm is proposed to fast obtain the thermal resistance and to predict the semiconductor junction temperature at different copper pad radii. The algorithm enables a fast sizing of copper pads based on different junction temperature limits. Finally, the developed thermal resistance model and algorithm are verified by computational fluid dynamics (CFD) simulations and experiments.
| Original language | English |
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| Title of host publication | Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018) |
| Number of pages | 7 |
| Place of Publication | USA |
| Publisher | IEEE Press |
| Publication date | Sept 2018 |
| Pages | 5087 - 5093 |
| ISBN (Print) | 978-1-4799-7313-2 |
| ISBN (Electronic) | 978-1-4799-7312-5 |
| DOIs | |
| Publication status | Published - Sept 2018 |
| Event | IEEE Energy Conversion Congress & Exposition ECCE 2018 - Portland, United States Duration: 23 Sept 2018 → 27 Sept 2018 http://www.ieee-ecce.org/2018/ |
Conference
| Conference | IEEE Energy Conversion Congress & Exposition ECCE 2018 |
|---|---|
| Country/Territory | United States |
| City | Portland |
| Period | 23/09/2018 → 27/09/2018 |
| Internet address |
Keywords
- printed circuit board (PCB)
- copper pad
- thermal resistance model