Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

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Abstract

Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.
Original languageEnglish
Title of host publicationProceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
Number of pages6
Place of PublicationBerlin, Germany
PublisherVDE Verlag GMBH
Publication date19 Aug 2022
ISBN (Print)978-3-8007-5757-2
Publication statusPublished - 19 Aug 2022
EventCIPS 2022 - 12th International Conference on Integrated Power Electronics Systems - Berlin, Germany
Duration: 15 Mar 202217 Mar 2022

Conference

ConferenceCIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
Country/TerritoryGermany
CityBerlin
Period15/03/202217/03/2022

Keywords

  • GaN device
  • Digital Twin
  • Thermal Analysis
  • Packaging technology

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