Projects per year
Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.
|Title of host publication||Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems|
|Number of pages||6|
|Place of Publication||Berlin, Germany|
|Publisher||VDE Verlag GMBH|
|Publication date||19 Aug 2022|
|Publication status||Published - 19 Aug 2022|
|Event||CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems - Berlin, Germany|
Duration: 15 Mar 2022 → 17 Mar 2022
|Conference||CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems|
|Period||15/03/2022 → 17/03/2022|
- GaN device
- Digital Twin
- Thermal Analysis
- Packaging technology
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CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S., Jørgensen, A. B., Uhrenfeldt, C., Beczkowski, S. M., Ahmad, F., Meinert, J. D., Kubulus, P. P., Takahashi, M., Sun, Z., Wang, R., Gao, Y., Zäch, M. R. & Steffensen, B.
01/01/2021 → 31/12/2025
Transistorization of Industrial Dielectric Heating Plants
Ahmad, F., Munk-Nielsen, S. & Jørgensen, A. B.
01/01/2021 → 31/12/2023
Project: PhD Project
RFheat: Radio Frequency Curing Technology
Munk-Nielsen, S., Uhrenfeldt, C., Jørgensen, A. B., Ahmad, F. & Steffensen, B.
01/09/2020 → 31/08/2021