Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Faheem Ahmad; Thore Stig Aunsborg; Szymon Beczkowski; Stig Munk-Nielsen; Asger Bjørn Jørgensen

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Faheem Ahmad, Thore Stig Aunsborg, Szymon Beczkowski, Stig Munk-Nielsen, Asger Bjørn Jørgensen

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

379 Downloads (Pure)

Abstract

Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.

Original language	English
Title of host publication	Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
Number of pages	6
Place of Publication	Berlin, Germany
Publisher	VDE Verlag GMBH
Publication date	19 Aug 2022
ISBN (Print)	978-3-8007-5757-2
Publication status	Published - 19 Aug 2022
Event	CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems - Berlin, Germany Duration: 15 Mar 2022 → 17 Mar 2022

Conference

Conference	CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
Country/Territory	Germany
City	Berlin
Period	15/03/2022 → 17/03/2022

Keywords

GaN device
Digital Twin
Thermal Analysis
Packaging technology

Access to Document

CIPS_2022_Paper_with_postprintAccepted author manuscript, 4.08 MB

https://ieeexplore.ieee.org/document/9862001

AUB Link

Search for the material in Aalborg University Library's search engine

1 Active
2 Finished

CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. M. (Project Participant), Ahmad, F. (Project Participant), Meinert, J. D. (Project Participant), Kubulus, P. P. (Project Participant), Takahashi, M. (Project Participant), Sun, Z. (Project Participant), Wang, R. (Project Participant), Gao, Y. (Project Participant), Zäch, M. R. (Project Participant), Meyer, S. (Project Participant), Liccardi, S. (Project Participant), Kristensen, N. H. (Project Participant) & Steffensen, B. (Project Coordinator)
Poul Due Jensen Foundation
01/01/2021 → 31/12/2026
Project: Research
Transistorization of Industrial Dielectric Heating Plants
Ahmad, F. (PI), Munk-Nielsen, S. (Supervisor) & Jørgensen, A. B. (Supervisor)
01/01/2021 → 31/12/2023
Project: PhD Project
RFheat: Radio Frequency Curing Technology
Munk-Nielsen, S. (PI), Uhrenfeldt, C. (CoI), Jørgensen, A. B. (CoI), Ahmad, F. (Project Participant) & Steffensen, B. (Project Coordinator)
Innovation Fund Denmark
01/09/2020 → 31/08/2021
Project: Research

1 PhD thesis

Transistorization of Industrial Dielectric Heating Plants
Ahmad, F., 2023, Aalborg Universitetsforlag. 179 p.
Research output: PhD thesis

Open Access
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Cite this

@inproceedings{cbf47353be074031b33d689ac2b54ad5,

title = "Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices",

abstract = "Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.",

keywords = "GaN device, Digital Twin, Thermal Analysis, Packaging technology",

author = "Faheem Ahmad and Aunsborg, {Thore Stig} and Szymon Beczkowski and Stig Munk-Nielsen and J{\o}rgensen, {Asger Bj{\o}rn}",

year = "2022",

month = aug,

day = "19",

language = "English",

isbn = "978-3-8007-5757-2",

booktitle = "Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems",

publisher = "VDE Verlag GMBH",

note = "CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, CIPS 2022 ; Conference date: 15-03-2022 Through 17-03-2022",

}

Ahmad, F, Aunsborg, TS, Beczkowski, S , Munk-Nielsen, S & Jørgensen, AB 2022, Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices. in Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE Verlag GMBH, Berlin, Germany, CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, Germany, 15/03/2022. <https://ieeexplore.ieee.org/document/9862001>

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices. / Ahmad, Faheem; Aunsborg, Thore Stig; Beczkowski, Szymon et al.
Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. Berlin, Germany: VDE Verlag GMBH, 2022.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

AU - Ahmad, Faheem

AU - Aunsborg, Thore Stig

AU - Beczkowski, Szymon

AU - Munk-Nielsen, Stig

AU - Jørgensen, Asger Bjørn

PY - 2022/8/19

Y1 - 2022/8/19

N2 - Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.

AB - Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.

KW - GaN device

KW - Digital Twin

KW - Thermal Analysis

KW - Packaging technology

M3 - Article in proceeding

SN - 978-3-8007-5757-2

BT - Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems

PB - VDE Verlag GMBH

CY - Berlin, Germany

T2 - CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems

Y2 - 15 March 2022 through 17 March 2022

ER -

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Abstract

Conference

Keywords

Access to Document

AUB Link

Fingerprint

Projects

CoDE: Center of Digitalized Electronics (CoDE)

Transistorization of Industrial Dielectric Heating Plants

RFheat: Radio Frequency Curing Technology

Research output

Transistorization of Industrial Dielectric Heating Plants

Cite this