Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters

Z. Yin, Rui Wu, Morten Hygum, Y. Yang, H. Wang

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)
Number of pages	6
Publisher	IEEE Press
Publication date	May 2019
Pages	3096-3101
ISBN (Print)	978-1-7281-1612-9
ISBN (Electronic)	978-89-5708-313-0
Publication status	Published - May 2019
Event	10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of Duration: 27 May 2019 → 30 May 2019

Conference	10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
Country/Territory	Korea, Republic of
City	Busan
Period	27/05/2019 → 30/05/2019

Series	International Conference on Power Electronics
ISSN	2150-6078

Access to Document

@inproceedings{f5beef6755a94cb4ae862c548dbbdfe6,

title = "Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters",

author = "Z. Yin and Rui Wu and Morten Hygum and Y. Yang and H. Wang",

year = "2019",

month = may,

language = "English",

isbn = "978-1-7281-1612-9",

series = "International Conference on Power Electronics",

publisher = "IEEE Press",

pages = "3096--3101",

booktitle = "2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)",

note = "10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia ; Conference date: 27-05-2019 Through 30-05-2019",

}

Yin, Z, Wu, R, Hygum, M, Yang, Y & Wang, H 2019, Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters. in 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). IEEE Press, International Conference on Power Electronics, pp. 3096-3101, 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia, Busan, Korea, Republic of, 27/05/2019. <https://ieeexplore.ieee.org/abstract/document/8796881>

Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters. / Yin, Z.; Wu, Rui; Hygum, Morten et al.
2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). IEEE Press, 2019. p. 3096-3101 (International Conference on Power Electronics).

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters

AU - Yin, Z.

AU - Wu, Rui

AU - Hygum, Morten

AU - Yang, Y.

AU - Wang, H.

PY - 2019/5

Y1 - 2019/5

M3 - Article in proceeding

SN - 978-1-7281-1612-9

T3 - International Conference on Power Electronics

SP - 3096

EP - 3101

BT - 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)

PB - IEEE Press

T2 - 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia

Y2 - 27 May 2019 through 30 May 2019

ER -