Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags

Zhijian Yin, Yongheng Yang, Huai Wang

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Abstract

The trend for the model-based design of modular multilevel converters (MMC) demands a better estimation of the submodule (SM) voltage stress. The transient voltage stresses of MMC SMs are important for the SM capacitor dimensioning and the robustness of power modules. This paper proposes an analytical model of the SM transient voltage stress under grid voltage sags. It is based on a simplified analysis of the MMC current control and circulating current control schemes. A case study reveals that a sufficient accuracy level can be achieved with the proposed model to estimate the transient voltage stress.
Original languageEnglish
Title of host publicationProceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Number of pages6
PublisherIEEE Press
Publication dateMay 2018
Pages1021-1026
Article number8507962
ISBN (Print)978-1-5386-4190-3
ISBN (Electronic)978-4-88686-405-5
DOIs
Publication statusPublished - May 2018
Event8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
Duration: 20 May 201824 May 2018

Conference

Conference8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
CountryJapan
CityNiigata
Period20/05/201824/05/2018
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), IEEJ Industry Applications Society (IAS)

Fingerprint

Electric potential
Electric current control
Analytical models
Capacitors

Keywords

  • dynamic analysis
  • grid voltage sag
  • modular multilevel converter
  • Submodulue voltage stress

Cite this

Yin, Z., Yang, Y., & Wang, H. (2018). Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags. In Proceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 (pp. 1021-1026). [8507962] IEEE Press. https://doi.org/10.23919/IPEC.2018.8507962
Yin, Zhijian ; Yang, Yongheng ; Wang, Huai. / Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags. Proceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, 2018. pp. 1021-1026
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abstract = "The trend for the model-based design of modular multilevel converters (MMC) demands a better estimation of the submodule (SM) voltage stress. The transient voltage stresses of MMC SMs are important for the SM capacitor dimensioning and the robustness of power modules. This paper proposes an analytical model of the SM transient voltage stress under grid voltage sags. It is based on a simplified analysis of the MMC current control and circulating current control schemes. A case study reveals that a sufficient accuracy level can be achieved with the proposed model to estimate the transient voltage stress.",
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Yin, Z, Yang, Y & Wang, H 2018, Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags. in Proceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018., 8507962, IEEE Press, pp. 1021-1026, 8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018, Niigata, Japan, 20/05/2018. https://doi.org/10.23919/IPEC.2018.8507962

Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags. / Yin, Zhijian; Yang, Yongheng; Wang, Huai.

Proceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, 2018. p. 1021-1026 8507962.

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

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Yin Z, Yang Y, Wang H. Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags. In Proceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press. 2018. p. 1021-1026. 8507962 https://doi.org/10.23919/IPEC.2018.8507962