Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

Ariya Sangwongwanich; Huai Wang; Frede Blaabjerg

doi:10.23919/EPE20ECCEEurope43536.2020.9215595

Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

Ariya Sangwongwanich, Huai Wang, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

1 Citation (Scopus)

79 Downloads (Pure)

Abstract

This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.

Original language	English
Title of host publication	Proceedings of 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)
Number of pages	8
Publisher	IEEE Press
Publication date	Oct 2020
Pages	1-8
Article number	9215595
ISBN (Print)	978-1-7281-9807-1
ISBN (Electronic)	978-9-0758-1536-8
DOIs	https://doi.org/10.23919/EPE20ECCEEurope43536.2020.9215595
Publication status	Published - Oct 2020
Event	EPE'20 ECCE Europe: 22nd European Conference on Power Electronics and Applications - Lyon, France Duration: 7 Sept 2020 → 11 Sept 2020

Conference

Conference	EPE'20 ECCE Europe: 22nd European Conference on Power Electronics and Applications
Country/Territory	France
City	Lyon
Period	07/09/2020 → 11/09/2020

Keywords

Mission profile
Photovoltaic
Power semiconductor device
Reliability
Thermal stress

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10.23919/EPE20ECCEEurope43536.2020.9215595

PID6500961Submitted manuscript, 1.52 MB

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Cite this

@inproceedings{b84912997aaa47fcab178cf8cddebda0,

title = "Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation",

abstract = "This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.",

keywords = "Mission profile, Photovoltaic, Power semiconductor device, Reliability, Thermal stress",

author = "Ariya Sangwongwanich and Huai Wang and Frede Blaabjerg",

year = "2020",

month = oct,

doi = "10.23919/EPE20ECCEEurope43536.2020.9215595",

language = "English",

isbn = "978-1-7281-9807-1",

pages = "1--8",

booktitle = "Proceedings of 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)",

publisher = "IEEE Press",

note = "EPE'20 ECCE Europe: 22nd European Conference on Power Electronics and Applications ; Conference date: 07-09-2020 Through 11-09-2020",

}

Sangwongwanich, A , Wang, H & Blaabjerg, F 2020, Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation. in Proceedings of 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)., 9215595, IEEE Press, pp. 1-8, EPE'20 ECCE Europe: 22nd European Conference on Power Electronics and Applications, Lyon, France, 07/09/2020. https://doi.org/10.23919/EPE20ECCEEurope43536.2020.9215595

Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation. / Sangwongwanich, Ariya ; Wang, Huai ; Blaabjerg, Frede.
Proceedings of 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe). IEEE Press, 2020. p. 1-8 9215595.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

AU - Sangwongwanich, Ariya

AU - Wang, Huai

AU - Blaabjerg, Frede

PY - 2020/10

Y1 - 2020/10

N2 - This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.

AB - This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.

KW - Mission profile

KW - Photovoltaic

KW - Power semiconductor device

KW - Reliability

KW - Thermal stress

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U2 - 10.23919/EPE20ECCEEurope43536.2020.9215595

DO - 10.23919/EPE20ECCEEurope43536.2020.9215595

M3 - Article in proceeding

SN - 978-1-7281-9807-1

SP - 1

EP - 8

BT - Proceedings of 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

PB - IEEE Press

T2 - EPE'20 ECCE Europe: 22nd European Conference on Power Electronics and Applications

Y2 - 7 September 2020 through 11 September 2020

ER -

Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

Abstract

Conference

Keywords

Access to Document

AUB Link

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Fingerprint

REPEPS: REliable Power Electronic based Power System

APETT: Advanced Power Electronic Technology and Tools

Cite this

Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

Abstract

Conference

Keywords

Access to Document

AUB Link

Other files and links

Fingerprint

Projects

REPEPS: REliable Power Electronic based Power System

APETT: Advanced Power Electronic Technology and Tools

Cite this