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Abstract
Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.
Original language | English |
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Title of host publication | Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability |
Editors | Katsuaki Suganuma |
Number of pages | 25 |
Publisher | Woodhead Publishing |
Publication date | Jun 2018 |
Pages | 199 - 223 |
Chapter | 8 |
ISBN (Print) | 978-0-08-102094-4 |
DOIs | |
Publication status | Published - Jun 2018 |
Series | Elsevier |
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ISSN | 0922-3444 |
Keywords
- Computer-aided engineering
- Computer software
- Power electronics
- Parasitic inductance
- Reliability modeling
- SiC module
- Thermal modeling
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Dive into the research topics of 'Computer-aided engineering simulations'. Together they form a unique fingerprint.Projects
- 1 Finished
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research