Abstract
Boost converters are needed in many applications that require the output voltage to be higher than the input voltage. Recently, boost type converters have been attracted by the industrial applications, and hence it has become an extremely hot topic of research. Recently, many researchers proposed the impedance source converters with their unique advantages as having a high voltage gain in a small range of duty cycle ratio. However, the thermal behaviour of the semiconductor devices and passive elements in the impedance source converter is an important issue from a reliability point of view and has not been investigated yet. Therefore this paper presents a comparison between the conventional boost, the Z-source, and the Y-source converters based on the thermal evaluation of semiconductors. In addition, the three topologies are also compared with respect to their efficiency. The operational principle, mathematical derivations, simulation results and finally conclusion comparisons are presented in this paper.
| Original language | English |
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| Title of host publication | Proceedings of 16 IEEE International Conference on Environment and Electrical Engineering (EEEIC), 2016 |
| Number of pages | 6 |
| Place of Publication | Florence, Italy |
| Publisher | IEEE Press |
| Publication date | Jun 2016 |
| Pages | 1297-1302 |
| ISBN (Electronic) | 978-1-5090-2320-2 |
| DOIs | |
| Publication status | Published - Jun 2016 |
| Event | 16 IEEE International Conference on Environment and Electrical Engineering - Florence, Italy Duration: 7 Jun 2016 → 10 Jun 2016 http://eeeic.eu/ |
Conference
| Conference | 16 IEEE International Conference on Environment and Electrical Engineering |
|---|---|
| Country/Territory | Italy |
| City | Florence |
| Period | 07/06/2016 → 10/06/2016 |
| Internet address |
Keywords
- Reliability
- Boost converter
- Z-source converter
- Y-source converter
- Winding losses
- Core losses
- Gain
- Thermal