Electrical Impedance Characterization of Bone Fractures in Presence of an Intramedullary Nail

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Abstract

This paper presents an electrical impedance characterization and measurement method for monitoring bone fracture healing progress after osteosynthesis, for cases applying an intramedullary nail. While existing solutions fail due to the presence of the nail, the proposed method makes active use of the nail to achieve accurate healing progress monitoring. The proposed method captures variations in the electrical impedance at the fracture site as body tissues transform from blood (hematoma) to fully recovered intact bone during healing. The proposed method therefore has the potential to be used for data acquisition of bone healing and pave the way for digitized diagnosis and treatment of bone fractures.
OriginalsprogEngelsk
TitelThe 20th IEEE International Conference on BioInformatics And BioEngineering
Antal sider4
ForlagIEEE
Publikationsdato2020
Sider705-708
ISBN (Trykt)978-1-7281-9575-9
ISBN (Elektronisk)978-1-7281-9574-2
DOI
StatusUdgivet - 2020
Begivenhed2020 IEEE 20th International Conference on Bioinformatics and Bioengineering (BIBE) - Cincinnati, USA
Varighed: 26 okt. 202028 okt. 2020

Konference

Konference2020 IEEE 20th International Conference on Bioinformatics and Bioengineering (BIBE)
Land/OmrådeUSA
ByCincinnati
Periode26/10/202028/10/2020
NavnInternational Conference on Bioinformatics and Bioengineering
ISSN2471-7819

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