A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids

Zhongchao Sun, Wendi Guo^*, Asger Bjørn Jørgensen

^*Corresponding author for this work

Research output: Contribution to journal › Journal article › Research › peer-review

2 results

Active
Packaging Reliability of Wide Band Gap Semiconductors Based on Digital Design Method and Physics of Failure
Sun, Z., Munk-Nielsen, S., Uhrenfeldt, C. & Jørgensen, A. B.
01/12/2021 → 30/11/2024
Project: PhD Project
CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S., Jørgensen, A. B., Uhrenfeldt, C., Beczkowski, S. M., Ahmad, F., Meinert, J. D., Kubulus, P. P., Takahashi, M., Sun, Z., Wang, R., Gao, Y., Zäch, M. R., Meyer, S. & Steffensen, B.
Poul Due Jensen Foundation
01/01/2021 → 31/12/2025
Project: Research