Original language | English |
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Journal | Journal of Materials Science: Materials in Electronics |
Volume | 25 |
Issue number | 7 |
Pages (from-to) | 2863-2871 |
Number of pages | 7 |
ISSN | 0957-4522 |
DOIs | |
Publication status | Published - Jul 2014 |
Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules
Kristian Bonderup Pedersen, David Benning, Peter Kjær Kristensen, Vladimir Popok, Kjeld Pedersen
Research output: Contribution to journal › Journal article › Research › peer-review
23
Citations
(Scopus)