Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir Popok, Kjeld Pedersen

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Original language	English
Journal	Microelectronics Reliability
Volume	53
Issue number	9-11
Pages (from-to)	1422-1426
ISSN	0026-2714
DOIs	https://doi.org/10.1016/j.microrel.2013.07.010
Publication status	Published - Sept 2013

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@article{0dcf5ac2242a477293c39f420c426742,

title = "Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules",

author = "Pedersen, {Kristian Bonderup} and Kristensen, {Peter Kj{\ae}r} and Vladimir Popok and Kjeld Pedersen",

year = "2013",

month = sep,

doi = "10.1016/j.microrel.2013.07.010",

language = "English",

volume = "53",

pages = "1422--1426",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Pergamon Press",

number = "9-11",

}

TY - JOUR

T1 - Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

AU - Pedersen, Kristian Bonderup

AU - Kristensen, Peter Kjær

AU - Popok, Vladimir

AU - Pedersen, Kjeld

PY - 2013/9

Y1 - 2013/9

U2 - 10.1016/j.microrel.2013.07.010

DO - 10.1016/j.microrel.2013.07.010

M3 - Journal article

SN - 0026-2714

VL - 53

SP - 1422

EP - 1426

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-11

ER -