Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors

Zhongchao Sun; Asger Bjorn Jorgensen; Nick Baker; Szymon Beczkowski; Wendi Guo; Stig Munk-Nielsen; Francesco Iannuzzo

doi:10.1109/APEC43580.2023.10131435

Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors

Zhongchao Sun, Asger Bjorn Jorgensen, Nick Baker, Szymon Beczkowski, Wendi Guo, Stig Munk-Nielsen, Francesco Iannuzzo

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

1 Citation (Scopus)

Abstract

Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to become a new industrial power semiconductors packaging application method to solve the failure of wire bonding liftoff and improve the reliability of power semiconductor applications. As a crucial characteristic in use, the thermal characteristics of liquid metal interconnects for power semiconductors are obtained experimentally in this paper. By powering a diode die in a bridge busbar liquid metal interconnect structure, the thermal resistance from the die to the ambient is extracted. The result shows that the liquid metal interconnects method has the potential to improve the thermal behavior of power semiconductors compared with wire-bonding interconnection. The finite element simulation explains the possible reasons causing abnormal temperature responses among some samples. Besides, during the test, a slow decline in the forward voltage of the module is observed.

Original language	English
Title of host publication	APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
Number of pages	6
Publisher	IEEE
Publication date	2023
Pages	1135-1140
Article number	10131435
ISBN (Electronic)	9781665475396
DOIs	https://doi.org/10.1109/APEC43580.2023.10131435
Publication status	Published - 2023
Event	38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 - Orlando, United States Duration: 19 Mar 2023 → 23 Mar 2023

Conference

Conference	38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023
Country/Territory	United States
City	Orlando
Period	19/03/2023 → 23/03/2023
Sponsor	IEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)

Series	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume	2023-March

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

liquid metal
packaging
simulation
thermal characteristics
wire-bonding

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10.1109/APEC43580.2023.10131435

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Cite this

@inproceedings{d4184b4253214b44b2ffd40a56c0263b,

title = "Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors",

abstract = "Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to become a new industrial power semiconductors packaging application method to solve the failure of wire bonding liftoff and improve the reliability of power semiconductor applications. As a crucial characteristic in use, the thermal characteristics of liquid metal interconnects for power semiconductors are obtained experimentally in this paper. By powering a diode die in a bridge busbar liquid metal interconnect structure, the thermal resistance from the die to the ambient is extracted. The result shows that the liquid metal interconnects method has the potential to improve the thermal behavior of power semiconductors compared with wire-bonding interconnection. The finite element simulation explains the possible reasons causing abnormal temperature responses among some samples. Besides, during the test, a slow decline in the forward voltage of the module is observed.",

keywords = "liquid metal, packaging, simulation, thermal characteristics, wire-bonding",

author = "Zhongchao Sun and Jorgensen, {Asger Bjorn} and Nick Baker and Szymon Beczkowski and Wendi Guo and Stig Munk-Nielsen and Francesco Iannuzzo",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 ; Conference date: 19-03-2023 Through 23-03-2023",

year = "2023",

doi = "10.1109/APEC43580.2023.10131435",

language = "English",

series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",

pages = "1135--1140",

booktitle = "APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition",

publisher = "IEEE",

address = "United States",

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Sun, Z , Jorgensen, AB, Baker, N, Beczkowski, S , Guo, W , Munk-Nielsen, S & Iannuzzo, F 2023, Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors. in APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition., 10131435, IEEE, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, vol. 2023-March, pp. 1135-1140, 38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023, Orlando, United States, 19/03/2023. https://doi.org/10.1109/APEC43580.2023.10131435

Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors. / Sun, Zhongchao ; Jorgensen, Asger Bjorn; Baker, Nick et al.
APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition. IEEE, 2023. p. 1135-1140 10131435 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, Vol. 2023-March).

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors

AU - Sun, Zhongchao

AU - Jorgensen, Asger Bjorn

AU - Baker, Nick

AU - Beczkowski, Szymon

AU - Guo, Wendi

AU - Munk-Nielsen, Stig

AU - Iannuzzo, Francesco

PY - 2023

Y1 - 2023

N2 - Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to become a new industrial power semiconductors packaging application method to solve the failure of wire bonding liftoff and improve the reliability of power semiconductor applications. As a crucial characteristic in use, the thermal characteristics of liquid metal interconnects for power semiconductors are obtained experimentally in this paper. By powering a diode die in a bridge busbar liquid metal interconnect structure, the thermal resistance from the die to the ambient is extracted. The result shows that the liquid metal interconnects method has the potential to improve the thermal behavior of power semiconductors compared with wire-bonding interconnection. The finite element simulation explains the possible reasons causing abnormal temperature responses among some samples. Besides, during the test, a slow decline in the forward voltage of the module is observed.

AB - Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to become a new industrial power semiconductors packaging application method to solve the failure of wire bonding liftoff and improve the reliability of power semiconductor applications. As a crucial characteristic in use, the thermal characteristics of liquid metal interconnects for power semiconductors are obtained experimentally in this paper. By powering a diode die in a bridge busbar liquid metal interconnect structure, the thermal resistance from the die to the ambient is extracted. The result shows that the liquid metal interconnects method has the potential to improve the thermal behavior of power semiconductors compared with wire-bonding interconnection. The finite element simulation explains the possible reasons causing abnormal temperature responses among some samples. Besides, during the test, a slow decline in the forward voltage of the module is observed.

KW - liquid metal

KW - packaging

KW - simulation

KW - thermal characteristics

KW - wire-bonding

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DO - 10.1109/APEC43580.2023.10131435

M3 - Article in proceeding

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T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

SP - 1135

EP - 1140

BT - APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition

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ER -

Sun Z , Jorgensen AB, Baker N, Beczkowski S , Guo W , Munk-Nielsen S et al. Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors. In APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition. IEEE. 2023. p. 1135-1140. 10131435. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, Vol. 2023-March). doi: 10.1109/APEC43580.2023.10131435

Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors

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Keywords

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