A Temperature-dependent Thermal Model of Silicon Carbide MOSFET Module for Long-term Reliability Assessment

Mengxing Chen, Huai Wang, Frede Blaabjerg, Xiongfei Wang, Donghua Pan

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

9 Citations (Scopus)
1 Downloads (Pure)

Search results

  • 2018

    SPEC 2018 Best Papers Award

    Chen, Mengxing (Recipient), Wang, Huai (Recipient), Blåbjerg, Frede (Recipient), Wang, Xiongfei (Recipient) & Pan, Donghua (Recipient), 13 Dec 2018

    Prize: Conference prizes