Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

    Research output: Contribution to journalJournal articleResearchpeer-review

    19 Citations (Scopus)
    1 Downloads (Pure)
    Original languageEnglish
    JournalMicroelectronics Reliability
    Volume53
    Issue number9-11
    Pages (from-to)1422-1426
    ISSN0026-2714
    DOIs
    Publication statusPublished - Sep 2013

    Cite this

    @article{0dcf5ac2242a477293c39f420c426742,
    title = "Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules",
    author = "Pedersen, {Kristian Bonderup} and Kristensen, {Peter Kj{\ae}r} and Vladimir Popok and Kjeld Pedersen",
    year = "2013",
    month = "9",
    doi = "10.1016/j.microrel.2013.07.010",
    language = "English",
    volume = "53",
    pages = "1422--1426",
    journal = "Microelectronics Reliability",
    issn = "0026-2714",
    publisher = "Pergamon Press",
    number = "9-11",

    }

    Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules. / Pedersen, Kristian Bonderup; Kristensen, Peter Kjær; Popok, Vladimir; Pedersen, Kjeld.

    In: Microelectronics Reliability, Vol. 53, No. 9-11, 09.2013, p. 1422-1426.

    Research output: Contribution to journalJournal articleResearchpeer-review

    TY - JOUR

    T1 - Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

    AU - Pedersen, Kristian Bonderup

    AU - Kristensen, Peter Kjær

    AU - Popok, Vladimir

    AU - Pedersen, Kjeld

    PY - 2013/9

    Y1 - 2013/9

    U2 - 10.1016/j.microrel.2013.07.010

    DO - 10.1016/j.microrel.2013.07.010

    M3 - Journal article

    VL - 53

    SP - 1422

    EP - 1426

    JO - Microelectronics Reliability

    JF - Microelectronics Reliability

    SN - 0026-2714

    IS - 9-11

    ER -