Projects per year
Abstract
A new borosilicate glass with lower loss and permittivity than any commercial glass has been proposed in this contribution as a substrate or interposer for mm-wave and THz integrated electronics. The glass is composed of a microstructure enclosing high-purity boron rich areas and silicon rich areas. This phase-separated areas are several orders of magnitude smaller than the wavelength at 1 THz.
| Original language | English |
|---|---|
| Title of host publication | 2024 IEEE INC-USNC-URSI Radio Science Meeting (Joint with AP-S Symposium) |
| Number of pages | 2 |
| Publisher | IEEE (Institute of Electrical and Electronics Engineers) |
| Publication date | 2024 |
| Pages | 261-262 |
| ISBN (Print) | 979-8-3503-5949-7 |
| ISBN (Electronic) | 978-9-46396-811-9 |
| DOIs | |
| Publication status | Published - 2024 |
| Event | 2024 IEEE International Symposium on Antennas and Propagation and ITNC-USNC-URSI Radio Science Meeting: APS-URSI 2024 - Florence, Italy Duration: 14 Jul 2024 → 19 Jul 2024 https://2024.apsursi.org/ |
Conference
| Conference | 2024 IEEE International Symposium on Antennas and Propagation and ITNC-USNC-URSI Radio Science Meeting |
|---|---|
| Country/Territory | Italy |
| City | Florence |
| Period | 14/07/2024 → 19/07/2024 |
| Internet address |
| Series | Proceedings (USNC-URSI Radio Science Meeting. Online) |
|---|---|
| ISSN | 2573-3036 |
Keywords
- 5G
- 6G
- characterization
- dielectric
- glass
- loss
- material
- measurements
- substrate
Fingerprint
Dive into the research topics of 'Novel Glass Material with Low Loss and Permittivity for 5G/6G Integrated Circuits'. Together they form a unique fingerprint.Projects
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Antenna design and integration on glass surfaces for the next generations of mobile communication (5G/6G)
Rodriguez Cano, R. (PI)
01/11/2021 → 30/06/2025
Project: Research