Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module with Balanced Thermal Stress

Yao Chang; Chengmin Li; Haoze Luo; Wuhua Li; Francesco Iannuzzo; Xiangning He

doi:10.1109/JESTPE.2020.2990208

Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module with Balanced Thermal Stress

Yao Chang, Chengmin Li, Haoze Luo^*, Wuhua Li, Francesco Iannuzzo, Xiangning He

^*Corresponding author for this work

Research output: Contribution to journal › Journal article › Research › peer-review

2 Citations (Scopus)

41 Downloads (Pure)

Abstract

In this article, the distributed-press-pack (DPP) packaging technology is developed to achieve balanced thermal stress on the chips. Under the current lumped-press-pack (LPP) style, the mechanical stress distribution on the chips, which is inherently uneven and coupled with thermal stress distribution, can be described with elastic half-space theoretical model. By decentralizing the lumped pressing load and positioning the loads evenly, a matrix of clamping array is formulated, and the mechanical stress distribution is compared under different clamping ways. Then a 3×3 clamping method that meets the trade-off between the balanced stress distribution and the packaging cost is chosen. Meanwhile, the busbar and heatsinks are integrated to improve the power density of the power module. Finally, a DPP prototype is implemented. By varying the pressure around the chips and heating them, the thermal distribution between parallel chips inside the prototype is compared and the effect of the proposed elastic half-space theory-based DPP packaging technology on the thermal stress balance is verified.

Original language	English
Article number	9078066
Journal	IEEE Journal of Emerging and Selected Topics in Power Electronics
Volume	9
Issue number	4
Pages (from-to)	3892-3903
Number of pages	12
ISSN	2168-6777
DOIs	https://doi.org/10.1109/JESTPE.2020.2990208
Publication status	Published - Aug 2021

Bibliographical note

Funding Information:
Manuscript received December 9, 2019; revised February 11, 2020 and March 30, 2020; accepted April 20, 2020. Date of publication April 24, 2020; date of current version July 30, 2021. This work was supported in part by the National Nature Science Foundations of China under Grant 51925702 and Grant 51677166 and in part by the National Key Research and Development Program of China under Grant 2017YFE0112400. Recommended for publication by Associate Editor Jun Wang. (Corresponding author: Haoze Luo.) Yao Chang, Chengmin Li, Wuhua Li, and Xiangning He are with the College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China (e-mail: cy_pe@zju.edu.cn; lichengmin@zju.edu.cn; woohualee@zju.edu.cn; hxn@zju.edu.cn).

Publisher Copyright:
© 2013 IEEE.

Keywords

Packaging technology
press-pack
reliability
thermal stress

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10.1109/JESTPE.2020.2990208

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@article{2ad8003ec84b4f6f9e9e51536e38616a,

title = "Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module with Balanced Thermal Stress",

abstract = "In this article, the distributed-press-pack (DPP) packaging technology is developed to achieve balanced thermal stress on the chips. Under the current lumped-press-pack (LPP) style, the mechanical stress distribution on the chips, which is inherently uneven and coupled with thermal stress distribution, can be described with elastic half-space theoretical model. By decentralizing the lumped pressing load and positioning the loads evenly, a matrix of clamping array is formulated, and the mechanical stress distribution is compared under different clamping ways. Then a 3×3 clamping method that meets the trade-off between the balanced stress distribution and the packaging cost is chosen. Meanwhile, the busbar and heatsinks are integrated to improve the power density of the power module. Finally, a DPP prototype is implemented. By varying the pressure around the chips and heating them, the thermal distribution between parallel chips inside the prototype is compared and the effect of the proposed elastic half-space theory-based DPP packaging technology on the thermal stress balance is verified.",

keywords = "Packaging technology, press-pack, reliability, thermal stress",

author = "Yao Chang and Chengmin Li and Haoze Luo and Wuhua Li and Francesco Iannuzzo and Xiangning He",

note = "Funding Information: Manuscript received December 9, 2019; revised February 11, 2020 and March 30, 2020; accepted April 20, 2020. Date of publication April 24, 2020; date of current version July 30, 2021. This work was supported in part by the National Nature Science Foundations of China under Grant 51925702 and Grant 51677166 and in part by the National Key Research and Development Program of China under Grant 2017YFE0112400. Recommended for publication by Associate Editor Jun Wang. (Corresponding author: Haoze Luo.) Yao Chang, Chengmin Li, Wuhua Li, and Xiangning He are with the College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China (e-mail: cy_pe@zju.edu.cn; lichengmin@zju.edu.cn; woohualee@zju.edu.cn; hxn@zju.edu.cn). Publisher Copyright: {\textcopyright} 2013 IEEE.",

year = "2021",

month = aug,

doi = "10.1109/JESTPE.2020.2990208",

language = "English",

volume = "9",

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Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module with Balanced Thermal Stress. / Chang, Yao; Li, Chengmin; Luo, Haoze et al.
In: IEEE Journal of Emerging and Selected Topics in Power Electronics, Vol. 9, No. 4, 9078066, 08.2021, p. 3892-3903.

Research output: Contribution to journal › Journal article › Research › peer-review

TY - JOUR

T1 - Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module with Balanced Thermal Stress

AU - Chang, Yao

AU - Li, Chengmin

AU - Luo, Haoze

AU - Li, Wuhua

AU - Iannuzzo, Francesco

AU - He, Xiangning

N1 - Funding Information: Manuscript received December 9, 2019; revised February 11, 2020 and March 30, 2020; accepted April 20, 2020. Date of publication April 24, 2020; date of current version July 30, 2021. This work was supported in part by the National Nature Science Foundations of China under Grant 51925702 and Grant 51677166 and in part by the National Key Research and Development Program of China under Grant 2017YFE0112400. Recommended for publication by Associate Editor Jun Wang. (Corresponding author: Haoze Luo.) Yao Chang, Chengmin Li, Wuhua Li, and Xiangning He are with the College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China (e-mail: cy_pe@zju.edu.cn; lichengmin@zju.edu.cn; woohualee@zju.edu.cn; hxn@zju.edu.cn). Publisher Copyright: © 2013 IEEE.

PY - 2021/8

Y1 - 2021/8

N2 - In this article, the distributed-press-pack (DPP) packaging technology is developed to achieve balanced thermal stress on the chips. Under the current lumped-press-pack (LPP) style, the mechanical stress distribution on the chips, which is inherently uneven and coupled with thermal stress distribution, can be described with elastic half-space theoretical model. By decentralizing the lumped pressing load and positioning the loads evenly, a matrix of clamping array is formulated, and the mechanical stress distribution is compared under different clamping ways. Then a 3×3 clamping method that meets the trade-off between the balanced stress distribution and the packaging cost is chosen. Meanwhile, the busbar and heatsinks are integrated to improve the power density of the power module. Finally, a DPP prototype is implemented. By varying the pressure around the chips and heating them, the thermal distribution between parallel chips inside the prototype is compared and the effect of the proposed elastic half-space theory-based DPP packaging technology on the thermal stress balance is verified.

AB - In this article, the distributed-press-pack (DPP) packaging technology is developed to achieve balanced thermal stress on the chips. Under the current lumped-press-pack (LPP) style, the mechanical stress distribution on the chips, which is inherently uneven and coupled with thermal stress distribution, can be described with elastic half-space theoretical model. By decentralizing the lumped pressing load and positioning the loads evenly, a matrix of clamping array is formulated, and the mechanical stress distribution is compared under different clamping ways. Then a 3×3 clamping method that meets the trade-off between the balanced stress distribution and the packaging cost is chosen. Meanwhile, the busbar and heatsinks are integrated to improve the power density of the power module. Finally, a DPP prototype is implemented. By varying the pressure around the chips and heating them, the thermal distribution between parallel chips inside the prototype is compared and the effect of the proposed elastic half-space theory-based DPP packaging technology on the thermal stress balance is verified.

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KW - reliability

KW - thermal stress

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U2 - 10.1109/JESTPE.2020.2990208

DO - 10.1109/JESTPE.2020.2990208

M3 - Journal article

AN - SCOPUS:85111871230

SN - 2168-6777

VL - 9

SP - 3892

EP - 3903

JO - IEEE Journal of Emerging and Selected Topics in Power Electronics

JF - IEEE Journal of Emerging and Selected Topics in Power Electronics

IS - 4

M1 - 9078066

ER -

Elastic Half-Space Theory-Based Distributed-Press-Pack Packaging Technology for Power Module with Balanced Thermal Stress

Abstract

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