A new test methodology for an exhaustive study of single-event-effects on power MOSFETs

G. Busatto, D. Bisello, G. Curr, P. Giubilato, F. Iannuzzo*, S. Mattiazzo, D. Pantano, A. Sanseverino, L. Silvestrin, M. Tessaro, F. Velardi, J. Wyss

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

5 Citations (Scopus)

Abstract

A new test methodology for the analysis of SEE in power MOSFET is presented. It is based on the combined use of an Ion Electron Emission Microscope (IEEM) and an experimental set-up which is able to acquire the drain signals associated to the impacts during the irradiation. The charge generation sensitivity map of a 200 V power MOSFET has been measured. It indicates the areas where the impacting particles generate the maximum charge. This map is strictly correlated with the sensitivity map of the device to SEB.
Original languageEnglish
JournalMicroelectronics Reliability
Volume51
Issue number9-11
Pages (from-to)1995-1998
Number of pages4
ISSN0026-2714
DOIs
Publication statusPublished - 1 Sept 2011
Externally publishedYes

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