Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules

Kristian Bonderup Pedersen, David Benning, Peter Kjær Kristensen, Vladimir Popok, Kjeld Pedersen

    Research output: Contribution to journalJournal articleResearchpeer-review

    21 Citations (Scopus)
    Original languageEnglish
    JournalJournal of Materials Science: Materials in Electronics
    Volume25
    Issue number7
    Pages (from-to)2863-2871
    Number of pages7
    ISSN0957-4522
    DOIs
    Publication statusPublished - Jul 2014

    Cite this

    @article{6c4e24e8d87c48448f4dc0fd802f509e,
    title = "Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules",
    author = "Pedersen, {Kristian Bonderup} and David Benning and Kristensen, {Peter Kj{\ae}r} and Vladimir Popok and Kjeld Pedersen",
    year = "2014",
    month = "7",
    doi = "10.1007/s10854-014-1953-8",
    language = "English",
    volume = "25",
    pages = "2863--2871",
    journal = "Journal of Materials Science: Materials in Electronics",
    issn = "0957-4522",
    publisher = "Springer",
    number = "7",

    }

    Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules. / Pedersen, Kristian Bonderup; Benning, David; Kristensen, Peter Kjær; Popok, Vladimir; Pedersen, Kjeld.

    In: Journal of Materials Science: Materials in Electronics, Vol. 25, No. 7, 07.2014, p. 2863-2871.

    Research output: Contribution to journalJournal articleResearchpeer-review

    TY - JOUR

    T1 - Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules

    AU - Pedersen, Kristian Bonderup

    AU - Benning, David

    AU - Kristensen, Peter Kjær

    AU - Popok, Vladimir

    AU - Pedersen, Kjeld

    PY - 2014/7

    Y1 - 2014/7

    U2 - 10.1007/s10854-014-1953-8

    DO - 10.1007/s10854-014-1953-8

    M3 - Journal article

    VL - 25

    SP - 2863

    EP - 2871

    JO - Journal of Materials Science: Materials in Electronics

    JF - Journal of Materials Science: Materials in Electronics

    SN - 0957-4522

    IS - 7

    ER -