TY - JOUR
T1 - Discovery of Loss Imbalance in SiC Half-Bridge Power Modules – Analysis and Validations
AU - Kjærsgaard, Benjamin Futtrup
AU - Liu, Gao
AU - Aunsborg, Thore Stig
AU - Dalal, Dipen Narendra
AU - Jørgensen, Jannick Kjær
AU - Rannestad, Bjørn
AU - Zhao, Hongbo
AU - Munk-Nielsen, Stig
PY - 2024/5/1
Y1 - 2024/5/1
N2 - It is commonly assumed that power semiconductor switching losses are the same for high-side and low-side devices in a half-bridge power module. However, this article reveals that the high-side SiC mosfet in a medium-voltage power module exhibits over 40% higher switching energy compared with the low-side SiC mosfet. The loss imbalance is attributed to the parasitic high-side gate capacitance in the power module, which contributes to the equivalent high-side Miller capacitance. A physics-based switching energy dissipation model is, therefore, proposed, distinguishing between low-side and high-side switching energy dissipation. Double pulse testing demonstrates that high-side switching energy dissipation increases by 5 mJ per 2.5-pF increment in the equivalent Miller capacitance, aligning closely with the analytically calculated increase of 6 mJ per 2.5 pF. Continuous power module testing shows a 10 °C increase in high-side junction temperature. The findings from this article offer crucial insights into research, design, and manufacturing of half-bridge modules enabled by SiC MOSFETs.
AB - It is commonly assumed that power semiconductor switching losses are the same for high-side and low-side devices in a half-bridge power module. However, this article reveals that the high-side SiC mosfet in a medium-voltage power module exhibits over 40% higher switching energy compared with the low-side SiC mosfet. The loss imbalance is attributed to the parasitic high-side gate capacitance in the power module, which contributes to the equivalent high-side Miller capacitance. A physics-based switching energy dissipation model is, therefore, proposed, distinguishing between low-side and high-side switching energy dissipation. Double pulse testing demonstrates that high-side switching energy dissipation increases by 5 mJ per 2.5-pF increment in the equivalent Miller capacitance, aligning closely with the analytically calculated increase of 6 mJ per 2.5 pF. Continuous power module testing shows a 10 °C increase in high-side junction temperature. The findings from this article offer crucial insights into research, design, and manufacturing of half-bridge modules enabled by SiC MOSFETs.
KW - Capacitance
KW - Capacitive couplings
KW - Couplings
KW - Double pulse testing
KW - Half-bridge switching dynamics
KW - MOSFET
KW - Medium voltage SiC MOSFETs
KW - Miller capacitance
KW - Multichip modules
KW - Power module modelling
KW - Silicon carbide
KW - Switches
KW - Switching loss
KW - Switching losses
UR - http://www.scopus.com/inward/record.url?scp=85186087233&partnerID=8YFLogxK
U2 - 10.1109/TPEL.2024.3368115
DO - 10.1109/TPEL.2024.3368115
M3 - Journal article
SN - 0885-8993
VL - 39
SP - 5806
EP - 5819
JO - I E E E Transactions on Power Electronics
JF - I E E E Transactions on Power Electronics
IS - 5
ER -