Smart SiC MOSFET accelerated lifetime testing

N. Baker*, F. Iannuzzo

*Kontaktforfatter

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

1 Citation (Scopus)
10 Downloads (Pure)

Resumé

Accelerated lifetime testing of power modules is time consuming and expensive due to the destructive nature of these tests. Therefore, it makes sense to extract as much data as possible from each consumed component. Traditional power cycling methods, however, monitor a single parameter and stop the test after this parameter reaches a predefined threshold. This leaves little data available for real-time analysis of the aging process, which instead must take place post-failure. In this paper, we present full results from a power cycling test on SiC MOSFETs which uses a novel method to extract both the semiconductor die resistance and bondwire resistance separately. Using this method, we are able to observe degradation phenomena that has previously been hidden when using conventional monitoring methods. We hope that the presentation of this data will demonstrate the incentive to incorporate smart monitoring functions during accelerated lifetime testing of power semiconductors. In essence, we aspire to advance the techniques in this area to provide a ‘window’ into the module, which allows the failure process to be accurately observed in real time. In turn, we hope these methods will allow more targeted improvements to module design from a reliability perspective.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Vol/bind88-90
Sider (fra-til)43-47
Antal sider5
ISSN0026-2714
DOI
StatusUdgivet - sep. 2018
Begivenhed29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark
Varighed: 1 okt. 20185 okt. 2018
Konferencens nummer: 29th
http://www.esref2018conf.org/

Konference

Konference29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer29th
LokationAKKC
LandDanmark
ByAalborg
Periode01/10/201805/10/2018
Internetadresse

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field effect transistors
Semiconductor materials
life (durability)
Monitoring
Testing
Aging of materials
Degradation
modules
incentives
cycles
leaves
monitors
degradation
thresholds

Citer dette

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title = "Smart SiC MOSFET accelerated lifetime testing",
abstract = "Accelerated lifetime testing of power modules is time consuming and expensive due to the destructive nature of these tests. Therefore, it makes sense to extract as much data as possible from each consumed component. Traditional power cycling methods, however, monitor a single parameter and stop the test after this parameter reaches a predefined threshold. This leaves little data available for real-time analysis of the aging process, which instead must take place post-failure. In this paper, we present full results from a power cycling test on SiC MOSFETs which uses a novel method to extract both the semiconductor die resistance and bondwire resistance separately. Using this method, we are able to observe degradation phenomena that has previously been hidden when using conventional monitoring methods. We hope that the presentation of this data will demonstrate the incentive to incorporate smart monitoring functions during accelerated lifetime testing of power semiconductors. In essence, we aspire to advance the techniques in this area to provide a ‘window’ into the module, which allows the failure process to be accurately observed in real time. In turn, we hope these methods will allow more targeted improvements to module design from a reliability perspective.",
keywords = "Power cycling, Reliability, SiC MOSFET",
author = "N. Baker and F. Iannuzzo",
year = "2018",
month = "9",
doi = "10.1016/j.microrel.2018.07.067",
language = "English",
volume = "88-90",
pages = "43--47",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Pergamon Press",

}

Smart SiC MOSFET accelerated lifetime testing. / Baker, N.; Iannuzzo, F.

I: Microelectronics Reliability, Bind 88-90, 09.2018, s. 43-47.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

TY - GEN

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AU - Baker, N.

AU - Iannuzzo, F.

PY - 2018/9

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N2 - Accelerated lifetime testing of power modules is time consuming and expensive due to the destructive nature of these tests. Therefore, it makes sense to extract as much data as possible from each consumed component. Traditional power cycling methods, however, monitor a single parameter and stop the test after this parameter reaches a predefined threshold. This leaves little data available for real-time analysis of the aging process, which instead must take place post-failure. In this paper, we present full results from a power cycling test on SiC MOSFETs which uses a novel method to extract both the semiconductor die resistance and bondwire resistance separately. Using this method, we are able to observe degradation phenomena that has previously been hidden when using conventional monitoring methods. We hope that the presentation of this data will demonstrate the incentive to incorporate smart monitoring functions during accelerated lifetime testing of power semiconductors. In essence, we aspire to advance the techniques in this area to provide a ‘window’ into the module, which allows the failure process to be accurately observed in real time. In turn, we hope these methods will allow more targeted improvements to module design from a reliability perspective.

AB - Accelerated lifetime testing of power modules is time consuming and expensive due to the destructive nature of these tests. Therefore, it makes sense to extract as much data as possible from each consumed component. Traditional power cycling methods, however, monitor a single parameter and stop the test after this parameter reaches a predefined threshold. This leaves little data available for real-time analysis of the aging process, which instead must take place post-failure. In this paper, we present full results from a power cycling test on SiC MOSFETs which uses a novel method to extract both the semiconductor die resistance and bondwire resistance separately. Using this method, we are able to observe degradation phenomena that has previously been hidden when using conventional monitoring methods. We hope that the presentation of this data will demonstrate the incentive to incorporate smart monitoring functions during accelerated lifetime testing of power semiconductors. In essence, we aspire to advance the techniques in this area to provide a ‘window’ into the module, which allows the failure process to be accurately observed in real time. In turn, we hope these methods will allow more targeted improvements to module design from a reliability perspective.

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KW - Reliability

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