TY - JOUR
T1 - Wear-out evolution analysis of multiple-bond-wires power modules based on thermo-electro-mechanical FEM simulation
AU - Jiang, Maogong
AU - Fu, Guicui
AU - Fogsgaard, Martin Bendix
AU - Bahman, Amir Sajjad
AU - Yang, Yongheng
AU - Iannuzzo, Francesco
PY - 2019/9
Y1 - 2019/9
N2 - In this paper, an electro-thermo-mechanical finite-element method (FEM) simulation approach is proposed to analyse the wear-out evolution of multiple-bond-wires chips in power electronic modules. Cracks are introduced along the simulation, based on the sensitive damage position at each simulation step, in order to emulate the realistic wear-out sequence occurring in real cases. This process has been made semi-automatically, by running many simulations, each time with updated crack geometry using the previous step results. The proposed method has been successfully used to interpret the typical on-state voltage degradation curve of accelerated life tests.
AB - In this paper, an electro-thermo-mechanical finite-element method (FEM) simulation approach is proposed to analyse the wear-out evolution of multiple-bond-wires chips in power electronic modules. Cracks are introduced along the simulation, based on the sensitive damage position at each simulation step, in order to emulate the realistic wear-out sequence occurring in real cases. This process has been made semi-automatically, by running many simulations, each time with updated crack geometry using the previous step results. The proposed method has been successfully used to interpret the typical on-state voltage degradation curve of accelerated life tests.
UR - http://www.scopus.com/inward/record.url?scp=85074528754&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2019.113472
DO - 10.1016/j.microrel.2019.113472
M3 - Journal article
AN - SCOPUS:85074528754
SN - 0026-2714
VL - 100-101
JO - Microelectronics Reliability
JF - Microelectronics Reliability
M1 - 113472
ER -
