A Review: New Designs of Heat Sinks for Flow Boiling Cooling

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

1 Citationer (Scopus)

Abstrakt

This paper presents a state-of-the-art review on heat sinks configurations used in flow boiling to cool electronic components. Two phase cooling methods and in this case using them in channels have disadvantages including complexities in flow field and instabities. The major role of designs of flow boiling heat sinks is to mitigate or delay these instabilities to reach stable and high performance cooling from heat transfer and pressure drop point of views. First, these instabilities in heat sinks with two phase coolants and phenomena leading to them are briefed. Then studies on presenting modifications and new designs of flow boiling heat sinks are reviewed. Description for five instabilities, three modifications and five heat sink configuration are addressed. It shows the highest cooling performance belongs to manifold microchannel and the piranha pin fin microstructure heat sinks.
OriginalsprogEngelsk
TitelProceedings of 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Antal sider6
ForlagIEEE
Publikationsdatosep. 2019
Artikelnummer8923505
ISBN (Elektronisk)978-1-7281-2078-2
DOI
StatusUdgivet - sep. 2019
Begivenhed 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italien
Varighed: 25 sep. 201927 sep. 2019

Konference

Konference 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
LandItalien
ByLecco
Periode25/09/201927/09/2019
NavnInternational Workshop on Thermal Investigations of ICs and Systems
ISSN2474-1515

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