This paper presents a state-of-the-art review on heat sinks configurations used in flow boiling to cool electronic components. Two phase cooling methods and in this case using them in channels have disadvantages including complexities in flow field and instabities. The major role of designs of flow boiling heat sinks is to mitigate or delay these instabilities to reach stable and high performance cooling from heat transfer and pressure drop point of views. First, these instabilities in heat sinks with two phase coolants and phenomena leading to them are briefed. Then studies on presenting modifications and new designs of flow boiling heat sinks are reviewed. Description for five instabilities, three modifications and five heat sink configuration are addressed. It shows the highest cooling performance belongs to manifold microchannel and the piranha pin fin microstructure heat sinks.
|Konference|| 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)|
|Periode||25/09/2019 → 27/09/2019|
|Navn||International Workshop on Thermal Investigations of ICs and Systems|