Packaging Reliability of Wide Band Gap Semiconductors Based on Digital Design Method and Physics of Failure

2024
A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids
Sun, Z., Guo, W. & Jørgensen, A. B., 8 mar. 2024, I: Journal of Electronic Materials. 53, 5, s. 2437-2454 18 s.
Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review

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2023
Thermal cycling characterization of integrated GaN power module
Sun, Z., Takahashi, M., Munk-Nielsen, S. & Jørgensen, A. B., 4 sep. 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. IEEE, 7 s. 10264265
Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

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